Vacuum-Sealed Optical Waveguide Module With Oxygen Getter

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Solution Overview

Problem

Existing optical integrated circuit modules using electro-optical polymer materials face degradation due to photo-oxidation phenomena caused by residual oxygen and moisture, despite hermetic sealing, which affects the reliability and performance of high-speed data transmission.

Innovation Solution

Incorporation of an oxygen getter within the optical integrated circuit module to absorb residual oxygen, combined with vacuum sealing to maintain an oxygen-free environment, effectively suppressing photo-oxidation and ensuring long-term reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If hermetic sealing is applied to the optical integrated circuit module, then moisture protection is improved, but residual oxygen and moisture remain inside the package causing photo-oxidation degradation

Engineering Contradiction:
Improveprotection against moistureVSAvoidphoto-oxidation degradation
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies vacuum sealing to create an inert environment by removing oxygen and moisture from the package interior. This is achieved by connecting the package to a vacuum pump through a groove structure, allowing the interior to be evacuated and sealed in a vacuum state, thereby preventing photo-oxidation of the electro-optical polymer material while maintaining hermetic protection.

Inventive Principle:
Principle #39Inert atmosphere (Inert environment)

Solution Approach 2:

The patent extracts harmful oxygen and moisture from the package interior through vacuum sealing. The groove structure enables the vacuum pump to remove gases from the package, extracting the harmful factors that cause degradation before hermetic sealing is completed, thus protecting the optical integrated circuit from photo-oxidation.

Inventive Principle:
Principle #2Taking out (Extraction)

2Object-affected harmful factors

If vacuum sealing is implemented to remove oxygen, then photo-oxidation is suppressed, but package structure complexity increases

Engineering Contradiction:
Improveoxygen removalVSAvoidpackage structure
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The package structure is segmented into distinct functional regions: a groove portion for vacuum connection, a sealing portion for hermetic closure, and an interior chamber for housing the optical integrated circuit. This segmentation allows the vacuum sealing function to be integrated into the package structure without requiring separate complex external systems, thereby reducing overall device complexity while achieving oxygen removal.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent merges the vacuum sealing function with the hermetic sealing structure by integrating the groove and sealing portions directly into the package body. This combination eliminates the need for separate vacuum pumping systems and external sealing mechanisms, achieving oxygen removal through a unified package structure that reduces overall device complexity.

Inventive Principle:
Principle #5Merging (Combining)

3Speed

If electro-optical polymer material is used in slot waveguide, then transmission speed is improved, but material degradation occurs due to photo-oxidation

Engineering Contradiction:
Improvedata transmission speedVSAvoidmaterial stability
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The patent creates an inert vacuum environment within the package to protect the electro-optical polymer material from photo-oxidation. By removing oxygen and moisture through vacuum sealing, the material is protected from degradation while maintaining its high-speed transmission capabilities, thus ensuring both speed performance and long-term reliability.

Inventive Principle:
Principle #39Inert atmosphere (Inert environment)

Solution Approach 2:

The patent applies beforehand cushioning by pre-evacuating the package interior through the groove structure before hermetic sealing. This prior removal of oxygen and moisture creates a protective environment that prevents future photo-oxidation degradation, cushioning the electro-optical polymer material against harmful effects throughout its operational lifetime while maintaining high-speed transmission performance.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly reduces the occurrence of photo-oxidation in electro-optical polymers, maintaining long-term reliability and performance of the optical integrated circuit module, particularly in high-speed data transmission applications.

Implementation Method 1

The oxygen getter is provided in an inner part of the cover and that absorbs oxygen contained in the inner part of the cover

Methodology Applied
Scientific EffectAbsorption: Absorption (physical)

Implementation Method 2

The cover seals, as vacuum sealing, at least the optical waveguide that is disposed on the optical integrated circuit element

Methodology Applied
Scientific EffectVacuum sealing: Vacuum

Implementation Method 3

an optical modulator that includes a slot waveguide in which an electro-optical polymer is applied and filled between two electrodes

Methodology Applied
Scientific EffectElectro-optic effect: Electro-Optic Effects

Data Source

PatentUS12510714B2Optical integrated circuit module and optical communication apparatus
Publication Date: 2025.12.30 FUJITSU OPTICAL COMPONENTS LTD
  • US12510714B2 patent drawing
  • US12510714B2 patent drawing
  • US12510714B2 patent drawing

AI summary

An optical integrated circuit module includes an optical integrated circuit element that includes as optical waveguide that is made by using an organic electro-optical material, and a cover that seals, as vacuum sealing, at least the optical waveguide that is disposed on the optical integrated circuit element. In addition, the optical integrated circuit module includes an oxygen getter that is provided in an inner part of the cover and that absorbs oxygen contained in the inner part of the cover.