Vacuum Share Module Layout for Faster Substrate Transfer
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Solution Overview
Problem
The existing substrate processing apparatuses face limitations in increasing substrate transfer speed, which hampers the productivity of semiconductor device manufacturing as the number of process chambers increases, due to difficulties in efficiently transferring substrates between process chambers.
Innovation Solution
A substrate processing apparatus with multiple transfer robots and a share module that operates in a vacuum state, allowing for parallel and serial transfer structures, enabling efficient substrate transfer between process chambers and maintaining a vacuum environment to prevent contamination and improve productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of process chambers is increased to increase substrate processing speed, then substrate processing capacity is improved, but substrate transfer speed becomes a bottleneck limiting productivity
Solution Approach 1:
The substrate transfer system is segmented into multiple independent transfer robots (first transfer robot, second transfer robot) operating in separate transfer chambers. Each robot can independently transfer substrates to different process chambers, eliminating the bottleneck of a single transfer mechanism and enabling parallel substrate processing across multiple chambers.
Solution Approach 2:
The transfer robots are arranged in a vertical stacked configuration (first transfer robot above, second transfer robot below) within the transfer chamber. This three-dimensional arrangement allows simultaneous substrate transfer operations in different vertical levels, effectively doubling the transfer capacity without increasing horizontal footprint and enabling parallel processing workflows.
2Productivity
If multiple transfer robots are introduced to improve substrate transfer efficiency, then productivity increases, but device complexity increases
Solution Approach 1:
Multiple transfer robots and process chambers are merged into a single integrated vacuum environment (transfer chamber). All transfer operations between load lock, process chambers, and unload occur within this shared vacuum space, eliminating the need for multiple vacuum break points and simplifying the overall system architecture despite having multiple robots.
Solution Approach 2:
The transfer chamber serves multiple functions: it acts as a vacuum environment for substrate transfer, a staging area for multiple robots, and a connection hub between load lock, process chambers, and unload. This multi-functional design reduces the need for separate dedicated chambers for each function, thereby reducing overall system complexity.
3Speed
If transfer operations are performed in atmospheric environment, then transfer speed may be faster, but substrate contamination and defects increase
Solution Approach 1:
The entire substrate transfer pathway from load lock to process chambers and to unload is conducted within a maintained vacuum environment. This inert atmosphere prevents substrate contamination by atmospheric particles, moisture, and oxidation, ensuring substrate cleanliness throughout the transfer process while maintaining efficient transfer speeds through direct robotic manipulation.
Data Source
AI summary
A substrate processing apparatus includes a plurality of process chambers for processing a substrate, a first transfer robot configured to transfer the substrate and arranged in a first transfer chamber, a second transfer robot configured to transfer the substrate and arranged in a second transfer chamber, and a share module arranged adjacent to the first transfer chamber and the second transfer chamber and configured to receive the substrate from any one of the first transfer robot and the second transfer robot, wherein an inside of each of the first transfer chamber and the second transfer chamber is in a vacuum state, and the first transfer robot and the second transfer robot transfer the substrate in a vacuum state.