Vacuum Suction Conductive Sheet Bonding for Faster Chip Packaging

Solution Overview

Problem

Conventional chip packaging methods using lead bonding result in low packaging efficiency and are prone to warping and cracking of metal leads and chips due to the sequential bonding process.

Innovation Solution

A chip packaging device employing conductive sheets and a vacuum suction movable assembly with a heating mechanism to bond solders on bonding pads and welding pins, allowing for simultaneous press-down and heating processes to achieve efficient electrical interconnection without warping or cracking.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If lead bonding method is used to bond metal leads one by one, then electrical interconnection between chip and substrate is achieved, but packaging efficiency is low and warping of metal leads occurs

Engineering Contradiction:

Improvepackaging efficiencyVSAvoidwarping of metal leads

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent merges multiple bonding operations into a single simultaneous process. Multiple conductive sheets are bonded to multiple bonding pads at the same time through a unified bonding mechanism, eliminating the sequential one-by-one bonding of conventional lead bonding methods. This parallel processing approach dramatically improves packaging efficiency while maintaining bonding precision.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces the conventional mechanical wire bonding system with a sheet-based bonding system. Instead of using metal leads that are prone to warping during sequential bonding, the invention uses flat conductive sheets that can be bonded simultaneously across multiple points, eliminating the mechanical stresses that cause lead warping.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Productivity

If lead bonding method is used to bond metal leads one by one, then electrical interconnection between chip and substrate is achieved, but cracking of chip occurs

Engineering Contradiction:

Improvepackaging efficiencyVSAvoidcracking of chip

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent combines multiple bonding operations into a single simultaneous process. Multiple conductive sheets are bonded to multiple bonding pads at the same time through a unified bonding mechanism, eliminating the sequential one-by-one bonding of conventional lead bonding methods. This parallel processing approach dramatically improves packaging efficiency while maintaining bonding precision.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces the conventional mechanical wire bonding system with a sheet-based bonding system. Instead of using metal leads that are prone to warping during sequential bonding, the invention uses flat conductive sheets that can be bonded simultaneously across multiple points, eliminating the mechanical stresses that cause lead warping.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Manufacturing precision

If sequential bonding of metal leads is performed, then electrical interconnection is achieved, but bonding process is time-consuming

Engineering Contradiction:

Improvebonding accuracyVSAvoidbonding process time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent merges multiple bonding operations into a single simultaneous process. Multiple conductive sheets are bonded to multiple bonding pads at the same time through a unified bonding mechanism, eliminating the sequential one-by-one bonding of conventional lead bonding methods. This parallel processing approach dramatically improves packaging efficiency while maintaining bonding precision.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent enables continuous bonding action by bonding all conductive sheets simultaneously in one operation. The bonding process continues without interruption or sequential steps, maintaining constant productive action across all bonding points at once, thereby eliminating time loss associated with sequential processing.

Inventive Principle:

Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables quick and efficient electrical interconnection between chips and substrates, improving packaging efficiency and preventing warping and cracking, compared to conventional lead bonding methods.

Implementation Method 1

a vacuum suction movable assembly configured to hold the plurality of conductive sheets, wherein a first end of each of the conductive sheets is disposed above a corresponding bonding pad

Methodology Applied

Scientific EffectVacuum suction: Vacuum

Implementation Method 2

a heating assembly configured to heat the solders on the bonding pads and the solders on the welding pins, so that the first end of each of the conductive sheets is welded to the corresponding bonding pad

Methodology Applied

Scientific EffectHeating: Heating

Data Source

PatentUS11764184B1Chip packaging device, chip packaging method, and package chip

Publication Date: 2023.09.19 HOSIN GLOBAL ELECTRONICS CO LTD

AI summary

The present disclosure provides a chip packaging device, a chip packaging method, and a package chip, and is related to a technical field of chip packaging. The chip packaging device includes conductive sheets, a vacuum suction movable assembly defining a variable suction surface, and a heating assembly. The variable suction surface sucks the plurality of conductive sheets. A first end of each of the conductive sheets is disposed above a corresponding bonding pads. A second end of each of the conductive sheets is disposed above a corresponding welding pin, so that when the variable suction surface is pressed down, the first end of each of the conductive sheets is pressed onto the corresponding bonding pad, and the second end of each of the conductive sheets is pressed onto the corresponding welding pin. The heating assembly heats solders on the bonding pads and the welding pins.