Vacuum-Modulated Two-Phase Spray Cooling for Parallel Die Control
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Solution Overview
Problem
Current thermal control systems for semiconductor dies face challenges in providing consistent temperature control, as Peltier devices degrade during testing, and existing solutions like temperature chambers and direct liquid micro channel architectures are limited in thermal performance and cannot address localized hotspots or high power density applications.
Innovation Solution
A direct jet impingement thermal solution with modifiable nozzle configurations, including adjustable standoff distance, fluid velocity, and temperature, allows for independent temperature control of individual dies, using a pressure-controlled spray chamber with a working fluid that can rapidly change phase to manage heat dissipation across a die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If Peltier devices are used for thermal cycling, then temperature control is achieved, but device reliability degrades over time requiring replacement
Solution Approach 1:
The invention changes the thermal control mechanism from solid-state Peltier devices to a two-phase fluid system where parameters such as fluid flow rate, vacuum pressure, and heater power are adjusted to achieve desired temperature cycling while avoiding device degradation
Solution Approach 2:
The invention introduces a hydraulic/pneumatic system using pressurized working fluid and vacuum pressure to enable two-phase cooling, replacing the electrical Peltier device mechanism with a fluid-based thermal management system that achieves temperature control without contact degradation
2Ease of operation
If temperature chambers are used for thermal cycling, then whole chamber temperature control is achieved, but individual die temperature control is not possible
Solution Approach 1:
The invention segments the thermal control system by providing individual nozzles for each die, allowing independent fluid injection and temperature control for each die rather than uniform chamber-wide control
Solution Approach 2:
The invention applies local quality by directing working fluid through individual nozzles to specific die locations, enabling localized temperature control and addressing hotspots on individual dies rather than uniform treatment
3Temperature
If direct contact cooling is used, then thermal performance improves, but thermal resistance of interface material limits performance
Solution Approach 1:
The invention extracts and eliminates the thermal interface material layer by using direct jet impingement of working fluid onto the die surface, removing the thermal resistance barrier entirely while maintaining direct thermal contact benefits
Solution Approach 2:
The invention utilizes phase transitions of the working fluid (liquid to vapor and back) to enhance heat transfer efficiency, allowing direct thermal management without interface materials through condensation and evaporation cycles
4Temperature
If direct liquid micro channel architecture is used, then uniform impingement is achieved, but temperature cycling and hotspot management are not possible
Solution Approach 1:
The invention introduces dynamics by enabling adjustable fluid flow rates, vacuum pressure levels, and heater power that can be changed in real-time to achieve temperature cycling and adapt to different thermal management requirements unlike static microchannel designs
Solution Approach 2:
The invention achieves universality by combining heating, cooling, and temperature cycling capabilities in a single system that can operate in different modes (single-phase or two-phase) to address various thermal management needs including hotspots and uniform cooling
5Power
If vapor chamber cooling is used for high power density, then cooling capability is provided, but dry-out occurs at high temperatures
Solution Approach 1:
The invention implements feedback control through sensors that monitor die temperature and working fluid conditions, dynamically adjusting vacuum pressure, fluid flow rate, and heater power to maintain optimal operation and prevent dry-out conditions
Solution Approach 2:
The invention applies preliminary action by pre-cooling the working fluid before it enters the spray chamber and maintaining vacuum pressure to ensure continuous liquid supply to the die surface, preventing dry-out before it can occur
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides flexible and efficient thermal management, enabling precise temperature control from -40°C to 135°C, accommodating high power densities without the risk of 'dry-out, and minimizing thermal gradients, thus enhancing reliability and performance in both testing and operational conditions.
Implementation Method 1
a pressure in the spray chamber is provided that enables a rapid phase change of the working fluid
Implementation Method 2
a vacuum source (1064) is provided with the spray chamber (1061) between the vacuum source (1064) and the reservoir (1063)
Implementation Method 3
a pump (1062) is provided between the spray chamber (1061) and the reservoir (1063), wherein the pump (1062) provides the working fluid (1046) to the spray chamber (1061)
Implementation Method 4
a working fluid (1046) is dispensed into the spray chamber (1061)... wherein the working fluid (1046) vaporizes to remove the heat from the die (1042)
Data Source
AI summary
Embodiments disclosed herein include a temperature control system. In an embodiment, the temperature control system comprises a fluid reservoir for holding a fluid, and a spray chamber fluidically coupled to the fluid reservoir. In an embodiment, a pump is between the spray chamber and the fluid reservoir, where the pump provides the fluid to the spray chamber. In an embodiment, the temperature control system further comprises, a plurality of fluid lines between the pump and the spray chamber, where individual ones of the plurality of fluid lines are configured to provide the fluid to the spray chamber. In an embodiment, the temperature control system further comprises, a vacuum source fluidically coupled to the spray chamber, where the vacuum source controls a pressure within the spray chamber.