Vacuum Adsorption Stage with Segmented Holes for Semiconductor Packages
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Solution Overview
Problem
Existing vacuum adsorption apparatuses for semiconductor packages struggle to maintain a consistent adsorptive force across varying package sizes, leading to inefficient fixation and potential waste of adsorptive force during cutting, cleaning, and drying processes in semiconductor assembly.
Innovation Solution
A vacuum adsorption apparatus with a stage featuring multiple holes and a vacuum cartridge system that adjusts adsorptive force distribution based on package size, using a combination of vacuum cartridges and a closing unit to selectively apply and conserve adsorptive force, ensuring efficient fixation and prevention of force wastage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a vacuum adsorption apparatus uses a fixed adsorption area, then the structure is simple, but the adsorptive force cannot be maintained consistently across varying package sizes
Solution Approach 1:
The stage is divided into multiple regions with different numbers of holes (first region with first number of holes, second region with second number of holes), allowing selective adsorption areas to be activated based on package size. This segmentation enables the system to adapt to various package sizes without requiring a completely different structure for each size.
Solution Approach 2:
The closing unit dynamically adjusts which regions are active by closing holes in regions that do not require adsorption. This dynamic adjustment allows the same physical structure to serve multiple package sizes efficiently, resolving the contradiction between adaptability and structural simplicity.
2Loss of energy
If vacuum adsorption is applied to the entire stage area, then all packages are secured, but adsorptive force is wasted when smaller packages are processed
Solution Approach 1:
Different regions of the stage have different numbers of holes configured according to package size requirements. The first region has a first number of holes suitable for smaller packages, while the second region has a second number of holes suitable for larger packages. This local differentiation ensures that adsorptive force is applied only where needed, preventing energy wastage while maintaining reliable fixation.
Solution Approach 2:
The closing unit pre-closes holes in regions that will not be used for the current package size before vacuum adsorption begins. This preliminary action prevents adsorptive force from being wasted in inactive regions while ensuring that the required regions are ready for immediate adsorption, thus balancing energy efficiency with fixation reliability.
3Adaptability or versatility
If the number of holes is increased to accommodate larger packages, then larger packages can be adsorbed, but adsorptive force is insufficient for precise fixation of smaller packages
Solution Approach 1:
The stage is configured with different hole densities in different regions: the first region has a first number of holes optimized for smaller packages, while the second region has a second number of holes optimized for larger packages. This local quality differentiation ensures that each package size receives the appropriate hole density for precise fixation, preventing the precision loss that would occur with a uniform high-hole-density design.
Solution Approach 2:
The closing unit preliminarily closes unnecessary holes before adsorption based on the detected package size. This preliminary action concentrates the adsorptive force on the appropriate region, ensuring that smaller packages receive sufficient adsorptive force for precise fixation even though the stage has capacity for larger packages. This resolves the contradiction between adaptability and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient and consistent adsorption of semiconductor packages of various sizes, optimizing the use of adsorptive force and preventing wastage, thereby enhancing the precision and efficiency of cutting, cleaning, and drying processes.
Implementation Method 1
at least one vacuum cartridge positioned under the stage and generating an adsorptive force through a suction hole
Implementation Method 2
generating an adsorptive force through a suction hole according to passage of compressed air
Data Source
AI summary
Provided is a vacuum adsorption apparatus and a method of adsorbing a semiconductor package in a vacuum state. The vacuum adsorption apparatus includes a housing having an opening formed on its top surface, a vacuum adsorption unit disposed in the housing, and a stage formed on the opening formed in the housing and including a plurality of holes. A pressure generated from the vacuum adsorption unit is applied to the top surface of the stage through the opening and the plurality of holes.