Vacuum Substrate Carrier for Irregular Lithography
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional lithographic apparatuses are inadequate for handling non-standard sized and shaped substrates, as they often require modification or new equipment, and existing solutions like substrate carriers involve bonding which complicates repositioning and increases contamination risks.
Innovation Solution
A substrate carrier that uses a vacuum to securely hold substrates of varying sizes and shapes, allowing for easy repositioning and processing without bonding, featuring a sealed space with a dense array of burls and apertures for efficient vacuum establishment and maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional lithographic apparatus are used with non-standard substrates, then the apparatus requires modification or new equipment, but this increases device complexity and cost
Solution Approach 1:
A substrate carrier is introduced as an intermediary component between the standard lithographic apparatus and non-standard substrates. The carrier has a standardized interface that fits the existing apparatus, while providing a customized surface to accommodate various substrate shapes and sizes. This mediator allows the apparatus to handle diverse substrates without requiring modification of the apparatus itself.
2Reliability
If bonding methods are used to secure substrates to carriers, then substrates are held firmly in position, but this complicates repositioning and increases contamination risks
Solution Approach 1:
The bonding method is replaced with a mechanical vacuum clamping system. The substrate carrier incorporates a vacuum chamber that creates a sealed environment around the substrate, using pressure differential to hold the substrate securely in position. This mechanical system allows for easy release and repositioning by simply adjusting the vacuum pressure, without requiring chemical bonding agents that could cause contamination.
3Ease of operation
If vacuum is used to hold substrates on the carrier, then repositioning is simplified and contamination reduced, but vacuum integrity must be maintained for precise positioning
Solution Approach 1:
The substrate carrier incorporates a flexible sealing mechanism that maintains vacuum integrity while allowing for substrate repositioning. The seal can adapt to slight movements and adjustments of the substrate, ensuring that vacuum pressure is maintained throughout the repositioning process. This flexible sealing prevents air leaks that would compromise positioning accuracy, while still enabling easy substrate manipulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the secure and efficient processing of irregularly shaped substrates within existing lithographic apparatuses, reducing the risk of contamination and simplifying handling, while maintaining vacuum integrity for precise positioning and pattern application.
Implementation Method 1
A substrate carrier arranged to hold a substrate in position using a vacuum, the vacuum being established in a sealed space created between the substrate carrier and the substrate
Data Source
AI summary
According to one of the aspects of the present invention there is provided a substrate carrier arranged to hold a substrate in position using a vacuum, the vacuum being established in a sealed space created between the substrate carrier and the substrate.