Vacuum Substrate Carrier for Dual-Side Processing
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Solution Overview
Problem
Existing substrate carrier systems fail to simultaneously tension substrates and allow unencumbered processing of both sides without operator intervention or system alteration, often leading to defects like wrinkles and limited processing options due to excessive frame thickness and mismatched thermal expansion coefficients.
Innovation Solution
A substrate carrier system featuring a frame with structurally manipulated outer edges and suspension arms that allow vertical translation, enabling tensioning and processing of both substrate sides without changing the carrier system, using a disposable frame with suction areas and registration means for robust handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a split frame with external forces is used to tension the substrate, then the substrate can be held taut during processing, but additional appliances are required to maintain external forces and apply tension
Solution Approach 1:
The patent replaces complex mechanical tensioning systems with a vacuum-based system. A vacuum chamber creates negative pressure that pulls the substrate taut against the carrier surface, eliminating the need for mechanical springs, weights, or external force applications while achieving consistent substrate tension.
Solution Approach 2:
The patent uses vacuum (pneumatic principle) to create the tensioning force. By applying negative pressure through vacuum ports in the carrier, the substrate is pulled uniformly across the carrier surface, providing stable tension without mechanical complexity.
2Strength
If a thick frame is used to maintain mechanical integrity, then the carrier can support the substrate, but it creates a hindrance to assembly techniques like screening and printing
Solution Approach 1:
The patent employs a thin-frame carrier design that relies on vacuum pressure rather than structural thickness for support. The frame can be minimalistic and thin because the vacuum field provides the necessary mechanical support and substrate holding force, allowing unencumbered access for screening, printing, and other assembly techniques.
3Strength
If the frame material has a higher CTE than the substrate, then the substrate becomes tensioned when heated, but exotic frame materials are required which are expensive
Solution Approach 1:
The patent replaces thermal expansion-based tensioning with vacuum-based tensioning. The vacuum system creates tension forces independent of thermal expansion coefficients, allowing the use of common, inexpensive frame materials without requiring exotic high-CTE materials while still achieving consistent substrate tension throughout processing.
4Stability of the object's composition
If the frame supports the edges of the substrate, then the substrate is held in place, but the ability to process these same edges is limited
Solution Approach 1:
The patent introduces a vacuum field as an intermediary between the frame and substrate. Instead of direct mechanical contact at the edges, the vacuum pressure distributes holding force across the entire substrate surface, allowing the edges to remain accessible for processing while maintaining stable substrate positioning through the vacuum field.
Data Source
AI summary
A substrate carrier system is provided for physical management of substrate(s) during a variety of assembly techniques performed on the both sides of the substrate(s) without dismounting or changing carrier systems.