Vacuum Processing Substrate Chuck Mechanism

Solution Overview

Problem

Conventional vacuum processing apparatuses have complex and costly substrate chuck mechanisms due to separate driving devices for substrate holding and chucking, which increase fabrication costs.

Innovation Solution

A vacuum processing apparatus with a substrate chuck mechanism that uses a shaft member with elastic members and a substrate chuck plate, allowing the substrate to be fixed onto the holder through reciprocal movement of the substrate holder, combining substrate chuck and transport operations to simplify the arrangement and reduce costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate driving devices are built for substrate holder movement and substrate chucking, then the substrate chuck device can perform its function, but the arrangement becomes complex and fabrication cost increases

Engineering Contradiction:

Improvesubstrate chuck functionVSAvoidarrangement complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the substrate holder driving device with the substrate chuck device, merging two previously separate functions into a single integrated mechanism. The driving device that reciprocally moves the substrate holder along the support shaft also performs the chucking operation through the substrate chuck mechanism member, thereby reducing the number of separate driving devices and simplifying the overall arrangement while maintaining reliable substrate chucking functionality

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The driving device is designed to perform multiple functions: it reciprocally moves the substrate holder within a predetermined range in the axial direction of the support shaft, and simultaneously operates the substrate chuck mechanism member to fix or release the substrate. This multi-functional design eliminates the need for a dedicated driving device solely for substrate chucking, reducing complexity and fabrication cost

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If separate driving devices are built for substrate holder movement and substrate chucking, then the substrate chuck device can perform its function, but fabrication cost increases

Engineering Contradiction:

Improvesubstrate chuck functionVSAvoidfabrication cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines the substrate holder driving device with the substrate chuck device, merging two previously separate functions into a single integrated mechanism. The driving device that reciprocally moves the substrate holder along the support shaft also performs the chucking operation through the substrate chuck mechanism member, thereby reducing the number of separate driving devices and simplifying the overall arrangement while maintaining reliable substrate chucking functionality

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The driving device is designed to perform multiple functions: it reciprocally moves the substrate holder within a predetermined range in the axial direction of the support shaft, and simultaneously operates the substrate chuck mechanism member to fix or release the substrate. This multi-functional design eliminates the need for a dedicated driving device solely for substrate chucking, reducing complexity and fabrication cost

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables a simpler and cost-effective substrate chuck operation by utilizing the elastic biasing of coil springs to clamp the substrate onto the holder, reducing the complexity and fabrication costs of the apparatus.

Implementation Method 1

a substrate chuck mechanism member which includes a shaft member, a first elastic member and a second elastic member that are provided at two ends, respectively, of the shaft member, and a substrate chuck plate provided at the end of the shaft member, and is additionally attached to the substrate holder using the substrate chuck plate by elastic biasing of the first elastic member

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 2

an operation of vertically moving a substrate holder and the transport operation of a substrate transport mechanism are performed in combination by attaching a substrate chuck mechanism member to a substrate holder provided in a vacuum processing chamber of a vacuum processing apparatus by means of a clamping action which utilizes the expansion/contraction elasticity of, for example, a coil spring

Methodology Applied

Scientific EffectSpring expansion/contraction: Spring

Data Source

PatentUS8858716B2Vacuum processing apparatus

Publication Date: 2014.10.14 CANON ANELVA CORP

AI summary

In a vacuum processing apparatus, a substrate chuck mechanism member is attached to a substrate holder provided in a vacuum processing chamber, includes a shaft member, first and second coil springs that are provided at the two ends, respectively, of the shaft member, and a substrate chuck plate provided at the end of the shaft member, and is additionally attached to the substrate holder using the substrate chuck plate by elastic biasing of the first coil spring. The holding state of the substrate on the substrate holder is changed by the expansion/contraction actions of the first and second coil springs in accordance with the reciprocal movement of the substrate holder.