Vacuum Substrate Fixation for Semiconductor Processing
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Solution Overview
Problem
In semiconductor manufacturing, there is a need for an efficient method to fix and secure substrates during processing, particularly in simpler substrate support units that do not rely on electrostatic chucks, while also improving heat transfer efficiency.
Innovation Solution
A substrate processing apparatus is designed with a substrate support unit connected to a vacuum system, utilizing multiple vacuum pumps and valves to create a vacuum environment that securely fixes the substrate to the support unit, allowing for effective heat transfer during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a substrate support unit without electrostatic chuck is used to simplify the structure, then device complexity is reduced, but the ability to securely fix the substrate deteriorates
Solution Approach 1:
The patent applies vacuum pumping (pneumatic principle) to fix the substrate to the support unit. A vacuum pump creates a pressure difference between the upper and lower surfaces of the substrate, generating a holding force that securely fixes the substrate without requiring electrostatic chucks or complex mechanical clamping structures.
2Reliability
If a vacuum pump is introduced to fix the substrate, then substrate fixation is improved, but device complexity increases
Solution Approach 1:
The vacuum pump serves multiple functions: it fixes the substrate to the support unit, maintains the vacuum environment in the processing chamber, and controls the release of the substrate by adjusting the vacuum level. This multi-functionality reduces the need for separate fixation mechanisms, thereby limiting the increase in device complexity.
3Ease of operation
If multiple valves and vacuum pumps are used to control the vacuum environment, then substrate fixation control is improved, but device complexity increases
Solution Approach 1:
The system uses dynamically controllable valves and vacuum pumps that can adjust the vacuum level in real-time. This allows the substrate fixation strength to be dynamically adjusted during different processing stages, providing precise control over substrate positioning and release without requiring permanently fixed complex mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus ensures secure fixation and efficient heat transfer to the substrate, enhancing processing efficiency and simplifying the substrate support unit structure without the need for electrostatic chucks.
Implementation Method 1
the first vacuum pump reduces a pressure in a space between the substrate support unit and the substrate to fix the substrate to the substrate support unit
Data Source
AI summary
A substrate processing apparatus including a substrate support unit connected to a vacuum pump to fix a substrate is provided. The substrate processing apparatus comprises a chamber including a processing space therein, a substrate support unit disposed in the processing space and for supporting a substrate, a first vacuum pump, a second vacuum pump connected to the processing space of the chamber, a first valve disposed between the first vacuum pump and the second vacuum pump, and a second valve disposed between the first vacuum pump and the substrate support unit, wherein the first vacuum pump reduces a pressure in a space between the substrate support unit and the substrate to fix the substrate to the substrate support unit in response to the second valve being turned on.