Vacuum Substrate Fixture for Precision Thin Film Cutting
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Solution Overview
Problem
Existing methods for cutting thin substrates, such as thin films and foils, face issues like material loss due to kerf, contamination from saw particles, deformation causing slippage and inaccurate cuts, and human error in manual alignment during blade shearing.
Innovation Solution
A fixture comprising a blade holder assembly and a substrate clamp with a vacuum system to secure the substrate and guide blades, ensuring precise and reproducible cuts by maintaining substrate rigidity and using interleaving blade guide slots for accurate alignment and cutting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If diamond saws are used to cut thin substrates, then cutting capability is achieved, but material loss occurs due to kerf and contamination from saw particles
Solution Approach 1:
The patent extracts the harmful kerf removal mechanism by replacing the diamond saw with a die cutting method that separates material without removing it. The die presses the foil into an underlying support to cut the pattern, achieving separation without the material loss inherent in sawing.
Solution Approach 2:
The patent introduces an intermediary support structure beneath the foil during cutting. This support receives the foil and provides a surface for the die to press against, enabling clean separation without direct contact between the cutting tool and the substrate that would cause material loss.
2Manufacturing precision
If a sharp die is pressed through the foil into a substrate to achieve regular cuts, then cutting regularity is improved, but the foil bends causing slippage and affecting electronic properties
Solution Approach 1:
The patent applies preliminary action by pre-bending the die at a specific angle before contact with the foil. This pre-positioning ensures that the die engages the foil at the optimal angle from the start of the cutting process, achieving clean separation without excessive pressing force that would cause bending and slippage.
Solution Approach 2:
The patent changes the geometric parameter of the die by bending it at a specific angle (e.g., 30-60 degrees) relative to the foil surface. This parameter modification allows the die to cut effectively without requiring vertical pressing force that would deform the foil, thus maintaining both cutting regularity and foil integrity.
3Stability of the object's composition
If dies are used to cut foil without pressing into a substrate, then foil deformation is reduced, but the die must be kept very sharp over a uniform area which is difficult to maintain
Solution Approach 1:
The patent applies local quality by concentrating the cutting function to a specific localized area on the die rather than requiring the entire die surface to remain sharp. The die is designed with a specific engagement zone where cutting occurs, allowing maintenance focus on this localized area rather than the entire uniform surface.
4Device complexity
If manual visual alignment is used for blade shearing, then equipment simplicity is maintained, but dicing yield and throughput are adversely affected by human error
Solution Approach 1:
The patent replaces the manual visual alignment mechanical system with a fixture-based mechanical guidance system. The fixture includes alignment features and guide structures that automatically position the die relative to the foil, eliminating human error while maintaining equipment simplicity.
5Ease of operation
If thin foils are allowed to remain flexible, then handling is easier, but uncut and cut sections roll or bow independently compromising dicing accuracy
Solution Approach 1:
The patent uses a flexible support film or carrier that the foil is bonded to during the cutting process. This support provides the necessary rigidity to prevent rolling and bowing of cut sections, while the foil itself remains flexible for handling. After cutting, the foil can be separated from the support.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables cutting thin substrates without deformation and material loss, achieving precise and reproducible cuts with minimal human error and improved dicing accuracy.
Implementation Method 1
The base plate communicates the vacuum environment to a stiff thin substrate support plate that has a plurality of small vacuum ports arranged in a pattern for securing a thin substrate
Data Source
AI summary
A fixture for cutting thin substrates, such as films, wafers, semiconductor layers and the like, using a blade holder assembly joined to a substrate clamp assembly. Each assembly has a plurality of members with the substrate clamp having a base plate that introduces a vacuum environment and a substrate support plate that uses the vacuum to secure the substrate in place. The blade holder assembly has interlocking projections in interleaving sheet members sandwiched between two bracket members that define slots for supporting a knife. Multiple slots allow the blade to be positioned in different positions and different orientations for cutting thin substrates held with vacuum pressure in the substrate clamp assembly.