Vacuum Substrate Flipper Module for Dual-Sided PVD Throughput
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Solution Overview
Problem
Conventional substrate processing systems require substrates to be removed from vacuum and flipped in atmosphere, leading to additional degassing operations that negatively impact throughput and can cause arcing due to lack of active cooling.
Innovation Solution
A flipper module within a load lock chamber enables substrates to be flipped in vacuum, allowing simultaneous deposition on both sides without removing the substrate from vacuum, using a clamp assembly with movable plates, guide-blocks, finger-stock assemblies, and sensors for precise handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrates are removed from vacuum and flipped in atmosphere for dual-sided deposition, then the substrate can be reoriented for processing the other side, but additional degassing time is required which negatively affects throughput
Solution Approach 1:
The patent maintains vacuum environment throughout the flipping and deposition process. The substrate remains in vacuum during the entire dual-sided processing, eliminating the need for degassing after atmospheric exposure. This resolves the contradiction by using vacuum (inert environment) to prevent moisture absorption while enabling efficient flipping and continuous processing.
Solution Approach 2:
The patent enables continuous vacuum processing by performing flipping operations within the vacuum chamber. The substrate is flipped and transferred between deposition chambers without breaking vacuum, allowing the useful action of deposition to continue uninterrupted without time-consuming degassing cycles.
2Productivity
If substrates are held vertically in the PVD chamber to sputter from both sides simultaneously, then dual-sided deposition can be performed, but no active cooling is available and arcing can occur which damages the panel
Solution Approach 1:
The patent uses separate deposition chambers for front and back side processing. The substrate is flipped between chambers rather than attempting simultaneous dual-sided deposition in one chamber. This segmentation allows each chamber to be optimized for specific conditions (horizontal positioning with active cooling) while achieving the overall goal of dual-sided deposition.
Solution Approach 2:
Instead of changing the substrate orientation to vertical for dual-sided processing, the patent maintains horizontal orientation and uses the time dimension (sequential processing through flipping) to achieve dual-sided deposition. This avoids the arcing problem associated with vertical positioning while still enabling dual-sided processing.
3Ease of operation
If conventional flipping methods are used, then substrates can be reoriented between depositions, but the large surface area of polymer panels absorbs moisture requiring lengthy degassing
Solution Approach 1:
The patent performs all flipping and transfer operations within vacuum environment. The large polymer surface area never exposes to atmospheric moisture, eliminating the need for lengthy degassing. This resolves the contradiction by maintaining inert vacuum environment throughout the reorientation process.
Data Source
AI summary
Apparatus and methods for flipping substrates in vacuum between PVD sputtering of each side for increasing throughput are provided herein. In some embodiments disclosed herein, a module of a processing system for flipping a substrate in vacuum is provided. The module includes a clamp assembly for securing the substrate, a motor assembly coupled to the substrate clamp assembly, for rotating the clamp assembly, a lift pin assembly, and a lift pin actuator for raising and lowering the lift pin assembly.