Vacuum Substrate Flipping for Dual-Sided PVD Without Degassing

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Solution Overview

Problem

In electronic device fabrication, processing large-area substrates requires flipping them for dual-sided physical vapor deposition (PVD) sputtering, which typically involves removing substrates from the vacuum and flipping in atmosphere, leading to inefficient degassing and potential arcing issues due to lack of active cooling.

Innovation Solution

A substrate processing system with a load lock chamber equipped with a flipper module that allows substrates to be flipped in vacuum, using a clamp assembly secured by motor assemblies for rotation and positioning, enabling PVD sputtering on both sides without exposing the substrate to atmosphere, thus eliminating additional degassing and allowing active cooling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If substrates are flipped in atmosphere between deposition processes, then the substrate can be reoriented for dual-sided processing, but additional degassing time is required which reduces throughput

Engineering Contradiction:

ImprovethroughputVSAvoiddegassing time

Core Design Contradiction:

ProductivityVSLoss of time

Solution Approach 1:

The substrate remains in vacuum throughout the entire dual-sided processing sequence, allowing continuous operation without interruption for atmosphere exposure and subsequent degassing. The flipper mechanism enables seamless transition between sides while maintaining vacuum conditions, eliminating idle degassing time and maximizing productive operation.

Inventive Principle:

Principle #20Continuity of useful action

Solution Approach 2:

A vacuum flipper mechanism serves as an intermediary device that enables substrate reorientation within the vacuum environment. This intermediate mechanism allows the substrate to be flipped without breaking vacuum, thereby avoiding the need for atmosphere exposure and the associated degassing step.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If substrates are held vertically in the PVD chamber for sputtering from both sides, then dual-sided processing is enabled, but active cooling is lost and arcing occurs

Engineering Contradiction:

Improvedual-sided processing capabilityVSAvoidarc discharge prevention

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The system dynamically changes the substrate orientation from vertical to horizontal during processing. The flipper mechanism allows the substrate to be positioned horizontally for active cooling during sputtering, then flipped to access the other side, maintaining optimal thermal conditions while enabling dual-sided processing.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The vacuum environment serves as an inert atmosphere that prevents arcing and allows horizontal substrate positioning with active cooling. By maintaining vacuum conditions during flipping and processing, the system eliminates the harmful effects of atmospheric exposure while enabling reliable dual-sided sputtering with proper thermal management.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

3Productivity

If large-area panels are processed, then high-value substrates can be manufactured, but moisture absorption increases requiring more efficient degassing

Engineering Contradiction:

Improvepanel processing capabilityVSAvoidmoisture absorption

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

By maintaining vacuum conditions throughout the entire dual-sided processing sequence, the system creates an inert environment that prevents moisture absorption from the atmosphere. Large-area panels are processed without exposure to humid air, eliminating the need for extended degassing operations and maintaining high productivity.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method increases throughput by eliminating the need for additional degassing and prevents arcing by maintaining the substrate in a vacuum environment during flipping, ensuring efficient and reliable dual-sided PVD sputtering.

Implementation Method 1

a clamp assembly for securing a substrate, a first motor assembly coupled to the clamp assembly for rotating the clamp assembly

Methodology Applied

Scientific EffectMechanical Force: Mechanical Force

Implementation Method 2

a first motor assembly coupled to the clamp assembly for rotating the clamp assembly

Methodology Applied

Scientific EffectMechanical Rotation: Mechanical Force

Implementation Method 3

a second motor assembly coupled to the first motor assembly for raising and lowering the first motor assembly and the clamp assembly

Methodology Applied

Scientific EffectMechanical Motion: Mechanical Force

Implementation Method 4

dual sided physical vapor deposition (PVD) sputtering of substrates

Methodology Applied

Scientific EffectPhysical Vapor Deposition: Physical Vapour Deposition

Data Source

PatentUS11881427B2Substrate flipping in vacuum for dual sided PVD sputtering

Publication Date: 2024.01.23 APPLIED MATERIALS INC

AI summary

A module of a processing system for flipping a substrate in vacuum includes a clamp assembly for securing the substrate, a first motor assembly coupled to the clamp assembly for rotating the clamp assembly, and a second motor assembly coupled to the first motor assembly for raising and lowering the first motor assembly and the clamp assembly.