Vacuum Substrate Flipping Module for Dual-Sided PVD Throughput
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In electronic device fabrication, processing large-area substrates requires flipping them between PVD sputtering on each side, which typically involves removing the substrate from vacuum and flipping in atmosphere, leading to inefficient degassing and reduced throughput.
Innovation Solution
A processing system with a load lock chamber equipped with a flipper module that allows substrates to be flipped in vacuum, using a clamp assembly secured by motor assemblies for rotation and positioning, enabling PVD sputtering on both sides without exposing the substrate to atmosphere.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If substrates are removed from vacuum and flipped in atmosphere, then the substrate can be reoriented for dual-sided processing, but additional degassing time is required and throughput is reduced
Solution Approach 1:
The patent implements a vacuum environment (inert atmosphere) within the load lock chamber to perform substrate flipping operations. By maintaining vacuum during the flipping process, the substrate does not absorb atmospheric moisture, eliminating the need for additional degassing cycles and preserving production throughput while enabling dual-sided processing
2Productivity
If substrates are held vertically in the PVD chamber, then both sides can be sputtered simultaneously, but active cooling is lost and arcing occurs
Solution Approach 1:
The patent introduces a horizontal flipping mechanism in the load lock chamber, adding a rotational dimension to the substrate processing. Instead of holding substrates vertically for dual-sided access, the system flips substrates horizontally between deposition cycles, maintaining optimal horizontal positioning for cooling and process stability while still enabling dual-sided sputtering
3Productivity
If large-area panels are processed, then production capacity increases, but moisture absorption increases and degassing time increases
Solution Approach 1:
The patent maintains vacuum (inert atmosphere) in the load lock chamber during substrate flipping operations. This prevents large-area panels from absorbing atmospheric moisture during the reorientation process, eliminating the need for extended degassing cycles and preserving production capacity while processing large substrates
Data Source
AI summary
A module of a processing system for flipping a substrate in vacuum includes a clamp assembly for securing the substrate, a first motor assembly coupled to the clamp assembly for rotating the clamp assembly, and a second motor assembly coupled to the first motor assembly for raising and lowering the first motor assembly and the clamp assembly.