Vacuum Substrate Module Layout With Integrated Transfer Chambers

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Solution Overview

Problem

Existing substrate processing apparatuses require multiple types of transfer modules and independent processing modules, leading to inefficiencies in space utilization, labor-intensive assembly, and redundant apparatuses due to varying module configurations.

Innovation Solution

Integration of one transfer chamber with two processing chambers into composite modules, allowing for unified transfer chamber types and shared apparatuses, and utilizing a magnetic levitation transfer unit for flexible module connection and maintenance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple types of transfer modules and independent processing modules are used, then module configuration flexibility is improved, but device complexity and space utilization worsen

Engineering Contradiction:

Improvemodule configuration flexibilityVSAvoidnumber of module types

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines the transfer module and processing module into a single integrated substrate processing apparatus. The transfer chamber and processing chamber are merged into one modular unit that can be directly connected to other identical modules, eliminating the need for separate transfer modules and reducing the number of different module types required.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated substrate processing apparatus serves multiple functions within a single module: it performs both substrate transfer operations in the transfer chamber and substrate processing operations in the processing chamber. This multi-functional design allows a single module type to replace multiple specialized module types.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple types of transfer modules and independent processing modules are used, then configuration adaptability is improved, but space utilization worsens

Engineering Contradiction:

Improveconfiguration adaptabilityVSAvoidspace utilization

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

By merging the transfer and processing functions into a single integrated module, the patent eliminates the space required for separate transfer modules and the spaces between independently connected modules. The integrated design allows for more compact arrangement and better space utilization in the substrate processing system.

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If independent processing modules with varying configurations are used, then processing versatility is improved, but assembly labor and apparatus costs worsen

Engineering Contradiction:

Improveprocessing versatilityVSAvoidassembly labor

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent segments the substrate processing system into identical, standardized integrated modules. Each module is a self-contained unit with the same configuration, making them interchangeable and easy to assemble. This segmentation into uniform modules reduces assembly complexity and labor requirements compared to configuring various independent module types.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The universal integrated module design allows the same module type to perform multiple functions (transfer and processing), reducing the variety of components that need to be assembled and configured. This universality simplifies the assembly process and reduces the skill level and time required for installation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Adaptability or versatility

If multiple types of transfer modules are used, then transfer flexibility is improved, but apparatus costs and redundancy worsen

Engineering Contradiction:

Improvetransfer flexibilityVSAvoidapparatus costs

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges the transfer function into each processing module, eliminating the need for separate transfer modules. This integration reduces the total number of components required, lowers apparatus costs by reducing redundancy, and simplifies the overall system architecture while maintaining transfer flexibility through the integrated design.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves production efficiency by reducing module types, eliminating wasteful spaces, minimizing labor, and lowering apparatus costs while enhancing configuration flexibility and maintenance accessibility.

Implementation Method 1

utilizing a magnetic levitation transfer unit for flexible module connection and maintenance

Methodology Applied

Scientific EffectMagnetic levitation: Maglev

Data Source

PatentUS20250349573A1Substrate processing apparatus

Publication Date: 2025.11.13 TOKYO ELECTRON LTD

AI summary

Provided is a substrate processing apparatus for processing a substrate, the substrate processing apparatus having: composite modules in each of which one transfer chamber having a transfer space for the substrate and a processing chamber having a processing space for the substrate are integrated, in which the composite modules are connected by connecting the transfer chambers adjacent to each other. The transfer spaces of the transfer chambers connected to each other communicate with each other. The transfer space is maintained in a vacuum atmosphere.