Sparse Vacuum Substrate Support for Precise Wafer Patterning
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Solution Overview
Problem
Current substrate support devices struggle to maintain precise positioning during processing, especially for thin semiconductor wafers, as small movements can compromise the accuracy of patterns formed by lasers, leading to potential substrate breakage and inaccuracies.
Innovation Solution
A support device with a sparse structure featuring a grid-shaped array of openings, where the joint area of the openings covers 40% or more of the substrate receiving region, utilizing suction openings for secure vacuum holding to minimize substrate displacement and vibrations during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a substrate support provides a continuous horizontal surface for supporting substrates, then the substrate is securely held in place, but the substrate cannot be processed with high precision due to movements and vibrations during processing
Solution Approach 1:
The substrate support surface is segmented into multiple discrete suction openings arranged in an array, rather than providing a continuous support surface. Each suction opening creates a localized vacuum zone that collectively holds the substrate securely while allowing the laser beam to access and process large portions of the substrate without obstruction.
Solution Approach 2:
The substrate support employs a porous-like structure with multiple openings distributed across the support surface. This sparse structure with openings allows the support body to maintain vacuum holding capability while being transparent to the laser beam, enabling simultaneous substrate securing and high-precision processing.
2Productivity
If a sparse structure with many openings is used in the support body, then the laser can access more substrate area for processing, but the substrate may not be held securely enough
Solution Approach 1:
The invention uses vacuum pneumatics through multiple suction openings to secure the substrate. The vacuum force is distributed across numerous small openings rather than a single large opening, creating multiple contact points that collectively provide strong holding force while allowing extensive laser access to the substrate surface.
Solution Approach 2:
The support structure parameters are optimized by controlling the size, number, and distribution of suction openings. The openings are designed to be sufficiently small to provide effective vacuum holding force while sufficiently numerous and strategically positioned to allow adequate laser beam access for efficient pattern processing.
3Productivity
If the joint area of openings is increased to 40% or more of the substrate receiving region, then more of the substrate can be processed, but the support structure becomes more complex
Solution Approach 1:
The support body is segmented into a grid-like array of standardized suction openings, where each opening is a simple geometric feature. This modular segmentation allows the complex function of providing 40% or more joint area for processing while maintaining relatively simple individual structural elements that can be manufactured using standard techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures high precision in forming patterns on substrates by securely holding the substrate in place, reducing vibrations and maintaining precise positioning, even when a large portion of the substrate is processed, thereby preventing breakage and ensuring accurate pattern formation.
Implementation Method 1
The support body includes one or more suction openings configured to be in fluid communication with a vacuum source arrangement
Data Source
AI summary
A support device includes a substrate receiving region. The support device includes a support body shaped as a pattern having an array of openings. The support body is a sparse structure wherein a joint area of the openings of the array of openings is 40% or more of the area of the substrate receiving region. The support body includes one or more suction openings configured to be in fluid communication with a vacuum source arrangement.