Vacuum Tunnel Substrate Transfer to Prevent Contamination
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Solution Overview
Problem
Conventional substrate transport systems in semiconductor manufacturing expose substrates to undesirable environments and contaminants by transporting them in non-vacuum conditions, which can lead to oxidation and contamination.
Innovation Solution
The implementation of a vacuum tunnel system with a substrate transport carriage and rotary stage that allows for the transfer of substrates between processing tools under vacuum conditions, incorporating features like magnetic levitation and emergency braking to ensure safe and clean transport.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If substrates are transported in conventional substrate carriers using automated transport devices, then substrate transport between processing locations is enabled, but substrates are exposed to undesirable environments and contaminants
Solution Approach 1:
The patent implements a vacuum tunnel that maintains a vacuum environment throughout the substrate transport path. The tunnel is sealed and evacuated to create a contaminant-free atmosphere, preventing oxidation and contamination of substrates during transport between processing tools. This directly addresses the harmful environmental exposure problem while maintaining transport functionality.
Solution Approach 2:
The vacuum tunnel acts as an intermediary environment between processing tools. Instead of transporting substrates through atmospheric conditions, the tunnel provides a mediating vacuum space that connects processing locations while protecting substrates from harmful atmospheric exposure.
2Device complexity
If substrates are transported in non-vacuum conditions, then transport infrastructure is simpler, but substrates are exposed to oxidizing species and contaminants
Solution Approach 1:
The system employs a vacuum tunnel that creates an inert vacuum environment for substrate transport. This eliminates oxidizing species and contaminants from the transport atmosphere, protecting substrates despite the increased system complexity required to maintain vacuum conditions.
3Object-affected harmful factors
If a vacuum tunnel system is implemented, then substrate protection from contaminants is improved, but system complexity increases
Solution Approach 1:
The vacuum tunnel serves as a dedicated intermediary infrastructure that isolates the substrate transport path from the atmospheric environment. This sealed vacuum corridor provides continuous protection throughout the transport journey, justifying the infrastructure complexity through comprehensive contamination prevention.
Solution Approach 2:
The vacuum environment is maintained continuously throughout the transport process, ensuring uninterrupted protection of substrates from contamination. The vacuum tunnel provides continuous useful action by maintaining protective conditions for the entire duration of substrate transit between processing tools.
Data Source
AI summary
Embodiments herein relate to a transport system and a substrate processing and transfer (SPT) system. The SPT system includes a transport system that connects two processing tools. The transport system includes a vacuum tunnel that is configured to transport substrates between the processing tools. The vacuum tunnel includes a substrate transport carriage to move the substrate through the vacuum tunnel. The SPT system has a variety of configurations that allow the user to add or remove processing chambers, depending on the process chambers required for a desired substrate processing procedure.