Vacuum Suction Head with Flexible Pad for Semiconductor Transfer
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Solution Overview
Problem
Existing vacuum suction heads for semiconductor products are not adaptable to handle various sizes and weights of suction objects efficiently, leading to frequent replacements and decreased productivity due to the need for specific suction pads for different semiconductor products.
Innovation Solution
A vacuum suction head design featuring a holder with a through hole and a flexible suction pad that protrudes below the holder's surface, combined with a flexible packing pad and an exhaust hole, allowing for effective suction and release of semiconductor products without excessive shaking, and incorporating a cutout part for fluid communication to manage vortices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a vacuum suction head uses a fixed rigid structure, then manufacturing precision is improved, but adaptability to various suction objects deteriorates
Solution Approach 1:
The suction pad is designed as a flexible component that can deform to conform to different suction object surfaces. The flexibility allows the rigid holder structure to maintain manufacturing precision while the flexible suction pad adapts to various shapes and sizes of semiconductor products, resolving the contradiction between structural stability and adaptability.
Solution Approach 2:
The suction pad incorporates dynamic flexibility through its material properties and structural design, allowing it to adapt its shape during operation. This dynamic characteristic enables the same holder structure to handle multiple suction object types without compromising either structural precision or adaptability.
2Reliability
If specific suction pads are used for different semiconductor products, then suction efficiency is improved, but productivity deteriorates due to frequent replacements
Solution Approach 1:
The holder is designed as a universal structure that can accommodate different suction pads for various semiconductor products. The standardized holder interface and modular suction pad design allow quick replacement while maintaining suction efficiency, thereby improving productivity without sacrificing reliability.
Solution Approach 2:
The suction head is divided into separable components (holder and suction pad), allowing the suction pad to be replaced independently. This segmentation enables maintenance of high suction efficiency through dedicated pads for different products while improving overall productivity through quick exchanges without replacing the entire holder assembly.
3Reliability
If vacuum pressure is applied to suck semiconductor products, then transfer reliability is improved, but electrostatic discharge damage may occur
Solution Approach 1:
The suction pad acts as an intermediary between the vacuum source and the semiconductor product. It provides a controlled interface that maintains reliable suction through vacuum pressure while its material properties and design features (such as grounding pathways or anti-static materials) prevent electrostatic discharge damage to the sensitive semiconductor product.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables stable suction and transfer of semiconductor products of varying sizes and weights without the need for frequent replacements of suction pads, enhancing productivity by maintaining suction efficiency and preventing damage from electrostatic discharge.
Implementation Method 1
a vacuum suction head that sucks a suction object using a vacuum pressure may be used
Implementation Method 2
a flexible suction pad that protrudes below the holder's surface
Data Source
AI summary
A vacuum suction head may include a holder including a through hole formed therein, a suction pad surrounding at least a portion of a side surface of the holder, and a packing pad on a lower surface of the holder. The suction pad may protrude below a lower surface of the holder. The packing pad may include a cutout part. The cutout part may allow a space between the suction pad and the packing pad such that the space and the through hole may be in fluid communication with each other.