Vacuum Suction Membrane for Non-Permanent Microprobe Termination
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional methods for terminating unused contact pads on electronic devices during testing are time-consuming, potentially damaging, and can result in permanent damage or residues, especially when using solder, which may affect the device's performance and lead to operational issues later on.
Innovation Solution
A non-conductive vacuum suction membrane mechanism, coupled with a non-conductive screw and contact elements, is used to create temporary electrical contacts with contact pads, allowing for efficient and non-destructive termination of unused ports without soldering or drilling, enabling flexible and customizable termination for various electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional soldering methods are used to terminate contact pads, then electrical contact is achieved, but the device may suffer from permanent damage, residues, and operational issues
Solution Approach 1:
The patent replaces the thermal-mechanical soldering process with a purely mechanical contact system. A contact element with a contact tip makes direct physical contact with the contact pad, eliminating the need for soldering. This mechanical contact achieves electrical connectivity without the harmful thermal and chemical effects of traditional soldering methods.
Solution Approach 2:
The patent introduces a contact element as an intermediary between the testing equipment and the contact pad. This contact element serves as a mediator that transfers electrical signals without requiring permanent attachment to the device, thereby avoiding damage while maintaining reliable electrical connection.
2Productivity
If soldering is used for termination, then electrical contact is established, but the process becomes time-consuming and potentially damaging
Solution Approach 1:
The contact element is pre-positioned and held by a holding structure that allows it to be quickly brought into contact with the contact pad. The preliminary preparation of the contact element and its holding mechanism enables rapid deployment without the time-consuming steps of soldering, flux application, and cleanup.
Solution Approach 2:
The patent extracts the time-consuming and damaging soldering steps from the termination process. By using a mechanical contact system, the method eliminates the need for heating, cooling, and cleanup operations associated with soldering, thereby significantly reducing the overall process time.
3Reliability
If permanent termination structures are used, then contact is established, but the device may suffer from permanent damage or residues
Solution Approach 1:
The patent employs a dynamic, reversible contact system where the contact element can be easily positioned and removed. The holding structure allows the contact element to be held firmly during testing but released without damage. This dynamic approach contrasts with permanent soldered connections, enabling repeated positioning and removal without affecting device integrity.
Solution Approach 2:
The holding structure is designed to provide controlled mechanical support to the contact element, preventing excessive force from being applied to the contact pad. This cushioning effect protects the device from damage while ensuring reliable electrical contact during the testing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a fast, reusable, and non-damaging method for terminating contact pads, reducing signal leakage and preventing permanent damage, while allowing for efficient high-frequency and high-bandwidth signal testing, and can be used with both electrical and optical signals.
Implementation Method 1
a non-conductive vacuum suction membrane adheres to a surface of the electronic device by suction force to facilitate the second electrical contact
Data Source
AI summary
A structure and method of facilitating testing of an electronic device (device under test or DUT) using a non-permanent and reusable structure to terminate contact pads and contact pin holes on a surface of the DUT.


