Vacuum Heat-Insulation Structure for Thermal Balance in Electronics
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Solution Overview
Problem
Current heat dissipation methods in electronic products, such as those using graphite, heat sinks, or air insulation, are inadequate for effectively protecting heat-sensitive components from excessive temperatures, as they either fail to provide sufficient heat insulation or increase the product's size and complexity, leading to unreliable heat management under varying power consumption conditions.
Innovation Solution
A closed hollow heat-insulation device with a vacuum cavity and a heat-conducting element that allows for heat dissipation from a heating element while isolating heat-sensitive devices, using a combination of heat-conducting and heat-insulating materials to maintain thermal balance and protect sensitive components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat-insulation materials (foam, wool, air gaps) are used, then heat insulation performance is improved, but the internal structure becomes complex and manufacturing precision requirements increase
Solution Approach 1:
The patent removes the traditional heat-insulation layer from the device structure and replaces it with a heat-dissipation device that actively manages thermal flow. This extraction of the insulation function and replacement with an active thermal management system resolves the contradiction by eliminating structural complexity while maintaining or improving thermal performance.
Solution Approach 2:
The patent replaces passive mechanical heat-insulation materials with an active electronic heat-dissipation system comprising Peltier elements, heat sinks, and thermal conduction paths. This substitution transforms thermal management from a passive structural feature to an active controllable system, resolving the contradiction between insulation performance and structural complexity.
2Quantity of substance
If battery capacity is increased, then power supply capability is improved, but heat generation increases requiring more complex heat management
Solution Approach 1:
The patent merges the heat-dissipation function with the battery support structure by integrating heat sinks and thermal conduction paths directly into the battery housing and mounting structures. This consolidation eliminates separate heat management components, resolving the contradiction by maintaining high battery capacity while reducing overall device complexity through functional integration.
3Area of stationary object
If display screen size is increased, then visual display capability is improved, but heat generation from the display increases
Solution Approach 1:
The patent introduces heat-dissipation plates and thermal conduction intermediaries between the display screen and the device housing to manage heat from larger displays. These intermediary thermal management components efficiently transfer heat away from the display area, resolving the contradiction by enabling larger screen areas while controlling heat generation through dedicated thermal pathways.
4Use of energy by moving object
If camera lens aperture is increased, then light gathering capability is improved, but heat generation from the camera module increases
Solution Approach 1:
The patent addresses camera heat management by extending thermal conduction paths in the vertical dimension through stacked heat-dissipation structures and thermal vias. This dimensional approach to heat management allows larger aperture lenses to maintain improved light gathering capability while heat is efficiently conducted away through multi-layer thermal pathways perpendicular to the camera module face.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat from heating elements while isolating heat-sensitive devices, ensuring their normal operation and improving the overall performance and reliability of electronic products by maintaining thermal balance and protecting against excessive temperatures.
Implementation Method 1
a first heat-conduction component, extending along a first direction, is built in the first battery mounting area... the first Peltier element is disposed between the first heat-conduction component and the heat-dissipation plate
Implementation Method 2
the first Peltier element is disposed between the first heat-conduction component and the heat-dissipation plate... a second Peltier element is disposed between the second heat-conduction component and the heat-dissipation plate
Data Source
Figure 1~2
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AI summary
Disclosed in the present application are a heat-insulation device and an electronic product. The heat-insulation device is of a closed hollow structure, and comprises a first cover body and a second cover body arranged opposite to each other; a vacuum cavity is formed in the heat-insulation device; the first cover body is made of a heat-conducting material; a heat-conducting element is provided in the vacuum cavity, and a first end of the heat-conducting element is in contact with the inner wall surface of the first cover body. The present application can be applied in the field of the electronic products. By means of heat conduction by a first cover plate, the heat dissipation of a heating element is implemented; by means of heat insulation by the vacuum cavity, a heat-sensitive device is protected; and by means of the heat-conducting element, the adjustment of local temperature of the second cover body is implemented, and thermal balance of the heat-sensitive device or the entire machine is thus achieved.