Vacuum Thermal Transfer Line Assembly for Low Heat and Vibration Loss

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Solution Overview

Problem

Existing thermal transfer technologies face inefficiencies due to thermal and mechanical energy transfer from a thermal source or sink to a mass, leading to increased thermal load on the cold source and reduced heat removal efficiency.

Innovation Solution

The use of thermal transfer line assemblies comprising a vacuum housing, suspension support housing, and thermal conduit, with continuous voids and minimal mechanical contact, to minimize thermal and mechanical energy transfer, utilizing materials like copper and insulation to reduce heat and vibration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a thermal transfer line assembly uses direct contact between the thermal conduit and housing structures, then mechanical support is simplified, but thermal energy transfer increases leading to higher thermal load on the cold source

Engineering Contradiction:
Improvemechanical support structureVSAvoidthermal load on cold source
Core Design Contradiction:
Device complexityVSLoss of energy

Solution Approach 1:

The patent introduces suspension support housing and continuous voids as intermediary elements between the thermal conduit and outer housing. These intermediaries provide mechanical support while minimizing thermal contact, thereby reducing thermal load on the cold source without oversimplifying the support structure

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent creates a vacuum environment within the housing to eliminate convective and conductive heat transfer through air. This inert environment (vacuum) allows the thermal conduit to be supported mechanically while preventing unwanted thermal energy transfer to the housing and surroundings

Inventive Principle:
Principle #39Inert atmosphere (Inert environment)

2Stability of the object's composition

If the thermal transfer line assembly uses extensive housing and support structures, then mechanical stability is improved, but thermal isolation is reduced leading to increased heat transfer

Engineering Contradiction:
Improvemechanical stabilityVSAvoidheat transfer efficiency
Core Design Contradiction:
Stability of the object's compositionVSLoss of energy

Solution Approach 1:

The patent uses thin-walled housing structures that provide mechanical stability while minimizing thermal mass and conductive heat transfer paths. The thin films and shells maintain structural integrity without creating excessive thermal bridges to the environment

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The housing is divided into separate components (suspension support housing, outer housing, continuous voids) that are strategically positioned to provide mechanical stability at critical points while maintaining thermal isolation in other areas. This segmented approach allows optimized mechanical support without compromising thermal performance

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances thermal transfer efficiency and reduces mechanical energy transfer, thereby minimizing the thermal load on the cold source and maintaining efficient heat removal.

Implementation Method 1

a vacuum housing; a suspension support housing within the vacuum housing; in at least one cross section, a continuous outer void between the vacuum housing and the suspension support housing

Methodology Applied
Scientific EffectVacuum insulation: Vacuum

Implementation Method 2

a thermal conduit within the suspension support housing; transferring thermal energy via a thermal conduit within an inner void of a suspension support housing

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250207716A1Thermal Transfer Line Assemblies, Methods for Manufacturing Thermal Transfer Line Assemblies, and Thermal Transfer Methods
Publication Date: 2025.06.26 MONTANA INSTRUMENTS CORP
  • US20250207716A1 patent drawing
  • US20250207716A1 patent drawing
  • US20250207716A1 patent drawing

AI summary

Thermal transfer line assemblies are provided. Methods for manufacturing a thermal transfer line assembly are also provided. Methods for transferring thermal energy are also provided.