Vacuum Transfer Module Backfill for Low H2O and O2 Partial Pressure

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Solution Overview

Problem

Substrate processing systems face challenges in efficiently transferring substrates between processing modules while maintaining low partial pressures of water vapor (PP H2O) and oxygen (PP O2) to prevent substrate surface damage.

Innovation Solution

The substrate processing tool incorporates a vacuum transfer module connected to multiple processing modules, with a controller managing pumps, valves, and a backfill source to reduce chamber pressure and backfill with inert gas, ensuring precise control of PP H2O and PP O2 levels during substrate transfers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If substrates are transferred between processing modules through vacuum transfer module, then substrate transfer efficiency is improved, but substrate surface contamination occurs due to high partial pressure of water vapor and oxygen

Engineering Contradiction:

Improvesubstrate transfer efficiencyVSAvoidsubstrate surface contamination

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces an inert gas (such as nitrogen or argon) into the vacuum transfer module to create an inert atmosphere during substrate transfer. This inert atmosphere displaces water vapor and oxygen, preventing oxidation and contamination of substrate surfaces while maintaining the vacuum environment for efficient transfer between processing modules.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Solution Approach 2:

The patent dynamically adjusts the partial pressure of water vapor and oxygen in the vacuum transfer module by controlling gas flow rates and vacuum pump operation. By changing these parameters in real-time based on substrate transfer requirements, the system maintains low contamination levels while preserving high transfer efficiency.

Inventive Principle:

Principle #35Parameter changes

2Object-affected harmful factors

If pumps are used to reduce chamber pressure in vacuum transfer module, then partial pressure of water vapor and oxygen is reduced, but transfer time is increased due to pump down and backfill cycles

Engineering Contradiction:

Improvepartial pressure of water vapor and oxygenVSAvoidsubstrate transfer time

Core Design Contradiction:

Object-affected harmful factorsVSLoss of time

Solution Approach 1:

The patent pre-condition the vacuum transfer module by reducing the partial pressure of water vapor and oxygen before substrate transfer begins. This preliminary action ensures that when substrates are transferred, the contamination risk is already minimized, reducing the need for lengthy pump-down cycles during active transfer operations.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent maintains continuous vacuum pumping and inert gas flow during substrate transfer operations, rather than cycling between pump-down and backfill modes. This continuous action sustains low partial pressures of contaminants throughout the transfer process, minimizing transfer time while preventing contamination.

Inventive Principle:

Principle #20Continuity of useful action

3Measurement precision

If multiple pumps are used to control chamber pressure, then pressure control precision is improved, but system complexity increases

Engineering Contradiction:

Improvechamber pressure control precisionVSAvoidpump system complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The patent divides the vacuum pumping function into multiple specialized pumps, each optimized for specific pressure ranges or contaminant removal. This segmentation allows precise control of chamber pressure at different stages of substrate transfer while managing complexity through modular pump selection and control.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables efficient and damage-free substrate transfers between processing modules by maintaining low PP H2O and PP O2 levels, thereby improving substrate processing throughput and minimizing contamination.

Implementation Method 1

control the one or more pumps to reduce a chamber pressure in the vacuum transfer module from a first chamber pressure to a second chamber pressure

Methodology Applied

Scientific EffectVacuum pumping: Pump

Implementation Method 2

backfill the vacuum transfer module with an inert gas to a third chamber pressure prior to permitting transfer of a substrate

Methodology Applied

Scientific EffectGas backfilling: Pressure Increase

Data Source

PatentUS20250038011A1Substrate processing tool with rapid and selective control of partial pressure of water vapor and oxygen

Publication Date: 2025.01.30 LAM RES CORP

AI summary

A substrate processing tool includes: a first processing module; a vacuum transfer module connected to the first processing module; one or more pumps; a backfill source; and one or more controllers. The one or more controllers are configured to: control the one or more pumps to reduce a chamber pressure in the vacuum transfer module from a first chamber pressure to a second chamber pressure and then backfill the vacuum transfer module with an inert gas to a third chamber pressure prior to permitting transfer of a substrate into the first processing module; subsequent to backfilling the vacuum transfer module, cause a transfer of the substrate from the vacuum transfer module to the first processing module; and cause the first processing module to process the substrate.