Vacuum Transfer Module Adaptor Configuration

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in increasing throughput and flexibility in arranging load-lock and processing modules, particularly in reducing the footprint and enhancing the degree of freedom in module arrangement within limited factory spaces.

Innovation Solution

A vacuum transfer module with adaptable adaptor attaching portions connects load-lock and processing modules, allowing for flexible arrangement and increased throughput by transferring substrates between multiple processing modules in a vacuum atmosphere, while reducing the apparatus's footprint through strategic module placement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the number of processing modules is increased to improve throughput, then productivity increases, but the footprint of the apparatus increases

Engineering Contradiction:
ImprovethroughputVSAvoidfootprint
Core Design Contradiction:
ProductivityVSArea of stationary object

Solution Approach 1:

The vacuum transfer module enables processing modules to be arranged in a two-dimensional configuration rather than a linear one, allowing multiple modules to share common transfer ports. This spatial reorganization increases throughput by enabling parallel processing while maintaining a compact footprint by utilizing vertical and lateral space more efficiently.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The vacuum transfer module serves as a shared resource that can connect to multiple processing modules simultaneously. This multi-functional component allows a single transfer module to support numerous processing modules, increasing system capacity without proportionally increasing the number of dedicated transfer modules, thus improving throughput while controlling footprint.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If the number of transfer modules is increased to connect more processing modules, then adaptability increases, but the footprint of the apparatus increases

Engineering Contradiction:
Improvedegree of freedom in arrangementVSAvoidfootprint
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The vacuum transfer module is designed as a universal interface that can connect to multiple different processing modules through standardized adaptor attaching portions. This single multi-functional transfer module replaces what would otherwise require multiple dedicated transfer modules, providing high adaptability and arrangement flexibility while maintaining a compact footprint.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of manufacture

If processing modules are arranged in a linear sequence, then ease of connection is improved, but adaptability of arrangement decreases

Engineering Contradiction:
Improveease of connectionVSAvoiddegree of freedom in arrangement
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The system transitions from a linear one-dimensional arrangement to a two-dimensional or multi-dimensional configuration where processing modules can be positioned around the vacuum transfer module. The sidewall-mounted adaptor attaching portions enable connections from multiple directions, providing both ease of connection through standardized interfaces and high adaptability for various spatial arrangements.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS10763139B2Vacuum transfer module and substrate processing apparatus
Publication Date: 2020.09.01 TOKYO ELECTRON LTD
  • US10763139B2 patent drawing
  • US10763139B2 patent drawing
  • US10763139B2 patent drawing

AI summary

A vacuum transfer module, to which a load-lock module and a plurality of processing modules for processing substrate in a vacuum atmosphere are connected, has therein a substrate transfer unit for transferring the substrate between the load-lock module and the plurality of processing modules. The vacuum transfer module includes: a housing in which a vacuum atmosphere is generated; and a plurality of adaptor attaching portions to which one of a first adaptor for connecting the load-lock module and a second adaptor for connecting the plurality of processing modules is attached, provided at a sidewall of the housing. The adaptor attaching portions are common for the first adaptor and the second adaptor.