Vacuum Transfer Module Adaptor Configuration
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in increasing throughput and flexibility in arranging load-lock and processing modules, particularly in reducing the footprint and enhancing the degree of freedom in module arrangement within limited factory spaces.
Innovation Solution
A vacuum transfer module with adaptable adaptor attaching portions connects load-lock and processing modules, allowing for flexible arrangement and increased throughput by transferring substrates between multiple processing modules in a vacuum atmosphere, while reducing the apparatus's footprint through strategic module placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of processing modules is increased to improve throughput, then productivity increases, but the footprint of the apparatus increases
Solution Approach 1:
The vacuum transfer module enables processing modules to be arranged in a two-dimensional configuration rather than a linear one, allowing multiple modules to share common transfer ports. This spatial reorganization increases throughput by enabling parallel processing while maintaining a compact footprint by utilizing vertical and lateral space more efficiently.
Solution Approach 2:
The vacuum transfer module serves as a shared resource that can connect to multiple processing modules simultaneously. This multi-functional component allows a single transfer module to support numerous processing modules, increasing system capacity without proportionally increasing the number of dedicated transfer modules, thus improving throughput while controlling footprint.
2Adaptability or versatility
If the number of transfer modules is increased to connect more processing modules, then adaptability increases, but the footprint of the apparatus increases
Solution Approach 1:
The vacuum transfer module is designed as a universal interface that can connect to multiple different processing modules through standardized adaptor attaching portions. This single multi-functional transfer module replaces what would otherwise require multiple dedicated transfer modules, providing high adaptability and arrangement flexibility while maintaining a compact footprint.
3Ease of manufacture
If processing modules are arranged in a linear sequence, then ease of connection is improved, but adaptability of arrangement decreases
Solution Approach 1:
The system transitions from a linear one-dimensional arrangement to a two-dimensional or multi-dimensional configuration where processing modules can be positioned around the vacuum transfer module. The sidewall-mounted adaptor attaching portions enable connections from multiple directions, providing both ease of connection through standardized interfaces and high adaptability for various spatial arrangements.
Data Source
AI summary
A vacuum transfer module, to which a load-lock module and a plurality of processing modules for processing substrate in a vacuum atmosphere are connected, has therein a substrate transfer unit for transferring the substrate between the load-lock module and the plurality of processing modules. The vacuum transfer module includes: a housing in which a vacuum atmosphere is generated; and a plurality of adaptor attaching portions to which one of a first adaptor for connecting the load-lock module and a second adaptor for connecting the plurality of processing modules is attached, provided at a sidewall of the housing. The adaptor attaching portions are common for the first adaptor and the second adaptor.


