Vacuum Transfer Particle Removal Using Cooled Dummy Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate processing systems require a cooling mechanism in the storage chamber to remove particles, which complicates the configuration and is not always necessary or efficient.
Innovation Solution
A substrate processing system that includes a vacuum transfer module, substrate processing module, load-lock module, substrate transfer robot, and a controller to cool dummy substrates and hold them in specific positions within the system for extended periods, allowing for particle removal without a cooling mechanism in the storage chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cooling mechanism is provided in the storage chamber to remove particles, then particle removal effectiveness is improved, but device complexity increases
Solution Approach 1:
The patent introduces a mediator (cooled substrate or cooled component) that transfers the particle-removal function from the storage chamber to an external cooling mechanism. The cooled substrate acts as an intermediary that attracts and collects particles through condensation, allowing particle removal without requiring the storage chamber itself to have cooling capabilities, thus reducing device complexity while maintaining effectiveness
Solution Approach 2:
The cooling function is extracted from the storage chamber and relocated to an external cooling mechanism. By removing the cooling requirement from the storage chamber environment, the patent simplifies the storage chamber design while still achieving particle removal through the cooled substrate that is temporarily introduced into the chamber
2Reliability
If a cooling mechanism is provided in the storage chamber to remove particles, then particle removal effectiveness is improved, but manufacturing complexity increases
Solution Approach 1:
The cooling function is extracted from the storage chamber and implemented as a separate, modular cooling mechanism. This extraction simplifies the manufacturing of the storage chamber itself, as it no longer requires integrated cooling components, while the cooling function can be implemented using standard, off-the-shelf cooling devices
Solution Approach 2:
The cooled substrate serves as a mediator that enables particle removal without requiring the storage chamber to be manufactured with cooling capabilities. This approach allows the storage chamber to be manufactured as a simple vacuum-compatible vessel, while the cooling function is added through a separate, easier-to-manufacture cooling mechanism
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes particle causes such as moisture from the storage chamber by condensing them on cooled substrates, reducing the number of condensation particles and other contaminants on the substrates, thereby simplifying the system configuration and improving efficiency.
Implementation Method 1
cooling at least one dummy substrate placed on the at least one substrate cooling stage to a first temperature of 5° C. to 20° C.
Data Source
AI summary
A substrate processing system is disclosed, comprising: a vacuum transfer module; a substrate processing module connected to the vacuum transfer module and configured to process a substrate in a depressurized environment; a load-lock module connected to the vacuum transfer module; at least one substrate cooling stage disposed in the load-lock module; at least one substrate transfer robot disposed the vacuum transfer module and having at least one end effector; and a controller configured to control a particle removal operation. The operation includes: cooling at least one dummy substrate placed on said at least one substrate cooling stage to a first temperature; and holding said at least one end effector in any one of a plurality of positions in the vacuum transfer module or the substrate processing module for a first time period in a state where at least one cooled dummy substrate is placed on said at least one end effector.