Single-Layer Vacuum Transfer Plate for Electronic Components
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Solution Overview
Problem
Existing apparatuses for transferring singulated electronic components require complex and costly designs with multiple parts, leading to instability and high manufacturing costs, especially when handling smaller packages.
Innovation Solution
A transfer assembly with a single-layer design utilizing a holding plate with dual sets of suction holes and separate vacuum chambers connected by a sealing sheet, allowing for simultaneous transfer of electronic components in an alternating format using two separate pneumatic paths, reducing the number of parts and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a complicated buffer plate with guiding walls in each pocket is used to accommodate packages, then the packages can be held during transfer, but the fabrication cost increases and manufacturing complexity increases
Solution Approach 1:
The buffer plate is divided into multiple pockets, each capable of holding individual packages. This segmentation allows independent control and positioning of packages while reducing the overall structural complexity compared to a solid buffer plate with all guiding walls.
Solution Approach 2:
The buffer plate serves multiple functions: holding packages during transfer, positioning packages in alternating format, and facilitating their release at different locations. This multi-functionality reduces the need for separate components, thereby reducing manufacturing complexity while maintaining reliability.
2Manufacturing precision
If sufficient clearance is provided between the walls and packages in buffer plate pockets, then accurate placement into trays or tubes is achieved, but the positioning stability of packages on the buffer plate decreases
Solution Approach 1:
The buffer plate pockets are designed with specific local dimensions and geometries optimized for each package type. The clearance is precisely controlled at critical locations to ensure accurate placement while maintaining sufficient friction and contact for stable positioning during transfer operations.
3Ease of operation
If a dual layer picker base with separate pneumatic lines is used to transfer packages in alternating format, then the transfer function is achieved, but the manufacturing cost and difficulty increase
Solution Approach 1:
The buffer plate integrates multiple functional layers into a single structure, combining the package holding, positioning, and release functions. This merging eliminates the need for separate dual-layer picker bases with complex pneumatic line routing, significantly reducing manufacturing difficulty while maintaining the alternating format transfer capability through controlled vacuum release sequences.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a cost-effective and stable transfer of singulated electronic components in an alternating format, reducing manufacturing costs and ensuring secure positioning of smaller packages, while maintaining accurate placement and alignment.
Implementation Method 1
a vacuum chamber located next to the holding plate which is connected only to the first set of suction holes; a first vacuum source for applying vacuum suction force in the first vacuum chamber
Implementation Method 2
the vacuum compartment including a sealing sheet in contact with the holding plate which has vacuum holes connecting the second vacuum chamber to the second set of suction holes
Data Source
AI summary
A transfer assembly for transferring first and second groups of electronic components simultaneously comprises a holding plate containing first and second sets of suction holes. The respective first and second sets of suction holes are operative to hold the first and second groups of electronic components respectively against the holding plate during transfer of the electronic components. A first vacuum chamber located next to the holding plate is connected only to the first set of suction holes. A vacuum compartment located within the first vacuum chamber encloses a second vacuum chamber. The vacuum compartment includes a sealing sheet in contact with the holding plate which has vacuum holes connecting the second vacuum chamber to the second set of suction holes. First and second vacuum sources are provided for applying vacuum suction forces separately in the first and second vacuum chambers.