Vacuum Transfer Valves for Contamination Isolation

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Solution Overview

Problem

Conventional vacuum processing apparatuses lack optimization of wafer processing efficiencies and productivity, leading to reduced reliability and reproducibility due to inadequate consideration of contamination prevention between vacuum transfer and processing chambers.

Innovation Solution

The apparatus incorporates first and second vacuum transfer vessels, intermediate chamber vessels, and a lock chamber, with strategically placed valves for controlled communication and isolation between these components to prevent contamination and enhance processing efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple vacuum chambers are coupled to improve productivity, then wafer processing efficiency is improved, but contamination between chambers increases

Engineering Contradiction:
Improvewafer processing efficiencyVSAvoidcontamination between chambers
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The vacuum system is divided into multiple independently controllable vacuum chambers (first vacuum chamber, second vacuum chamber, third vacuum chamber) that can be isolated from each other using valve mechanisms. This allows simultaneous operation of multiple chambers without cross-contamination, enabling improved productivity while maintaining chamber isolation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A transfer chamber serves as an intermediary space between the first and second vacuum chambers. The transfer chamber is equipped with separate valve mechanisms that control communication with each vacuum chamber independently. This intermediary structure allows wafers to be transferred between chambers while preventing direct atmospheric contamination and enabling independent pressure control of each chamber.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If valves are added to prevent contamination between chambers, then contamination is reduced, but device complexity increases

Engineering Contradiction:
Improvecontamination preventionVSAvoidvalve mechanism complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The transfer chamber is designed with multi-functional valve mechanisms that can simultaneously control communication with multiple vacuum chambers. Each valve mechanism serves multiple purposes: isolating chambers, enabling wafer transfer, and maintaining pressure differentials. This universal design reduces the need for separate specialized components for each function.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The valve mechanisms are integrated into the chamber structure itself, allowing the chambers to self-regulate their isolation and communication states. The system includes control means that automatically manage valve operations based on operational requirements, reducing the need for external complex control systems.

Inventive Principle:
Principle #25Self-service

3Productivity

If transfer chambers are made larger to accommodate multiple chambers, then wafer transfer capability is improved, but chamber dimension requirements increase

Engineering Contradiction:
Improvewafer transfer capabilityVSAvoidtransfer chamber volume
Core Design Contradiction:
ProductivityVSVolume of moving object

Solution Approach 1:

The transfer chamber is segmented into distinct regions with separate valve access points to different vacuum chambers. This segmentation allows the transfer chamber to efficiently handle wafer transfers to multiple chambers without requiring a single large open space, optimizing volume utilization while maintaining transfer capability.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS8747046B2Vacuum processing apparatus
Publication Date: 2014.06.10 HITACHI HIGH TECH CORP
  • US8747046B2 patent drawing
  • US8747046B2 patent drawing
  • US8747046B2 patent drawing

AI summary

The vacuum processing apparatus is comprised of two vacuum transfer vessels in which a wafer is transferred through; two vacuum process vessels connected to these vacuum transfer vessels respectively; an intermediate chamber vessel capable of storing thereinto the wafer connected between the vacuum transfer vessels; a lock chamber connected to one of the vacuum transfer vessels; and a plurality of valves disposed among the vacuum transfer vessels, the vacuum process vessels, the intermediate chamber vessel, and the lock chamber respectively, for airtightly opening/closing communications among these vessels and the chamber; in which any one of the valves disposed on both sides of the intermediate chamber vessel is closed before the valves disposed between processing chambers of the vacuum process vessels and vacuum transfer chambers of the vacuum transfer vessels is opened.