Vacuum Transport Chamber Segmentation for Gas Mixing Prevention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Vacuum processing apparatuses face challenges in improving throughput due to gas mixing issues between process chambers, which degrade processing accuracy and contaminate workpieces, even when using mechanisms like pressure adjustment and sequential valve switching.
Innovation Solution
A semiconductor processing apparatus with a load lock and vacuum transport chambers, where process chamber valves can be independently controlled without influencing each other, allowing concurrent transfer of workpieces between the load lock and process chambers without gas mixing, using a configuration with separate vacuum transport chambers and control mechanisms for each process chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If workpieces are concurrently transferred to multiple process chambers using a single shared vacuum transport chamber, then throughput is improved, but gases from different process chambers mix and contaminate workpieces
Solution Approach 1:
The single shared vacuum transport chamber is divided into multiple independent vacuum transport chambers, each dedicated to transferring workpieces to a specific process chamber. This segmentation prevents gas mixing between chambers while enabling concurrent workpiece transfers to multiple process chambers simultaneously, thus improving throughput without contamination.
2Object-affected harmful factors
If pressure adjustment is used to prevent gas mixing, then gas contamination is reduced, but the system complexity and control difficulty increase
Solution Approach 1:
Instead of using complex pressure adjustment mechanisms to prevent gas mixing, the system segments the vacuum transport path into separate chambers. Each chamber is isolated with its own valve controls, providing a simpler mechanical solution that prevents gas mixing through physical separation rather than dynamic pressure control.
3Object-affected harmful factors
If sequential valve switching is used to transfer workpieces, then gas mixing is prevented, but transfer rate and throughput are reduced
Solution Approach 1:
The system segments the transfer path into multiple independent vacuum transport chambers, each with its own valve controls. This allows simultaneous opening of multiple valves to different chambers, enabling concurrent workpiece transfers to multiple process chambers at the same time, thus dramatically increasing transfer rate while maintaining gas isolation.
Solution Approach 2:
Each vacuum transport chamber acts as an intermediary space between the load lock and a specific process chamber. These intermediary chambers provide isolated transfer paths that enable parallel operations, allowing workpieces to be transferred to multiple chambers simultaneously without direct gas exposure between chambers.
Data Source
AI summary
A vacuum processing apparatus is disclosed for processing workpieces. The apparatus includes a load lock adapted to store the workpiece inside and to be switched between atmosphere and vacuum. Vacuum transport chambers are connected to the load lock and to the corresponding process chambers in a state where the load lock and each of the process chambers are isolated. The workpiece can be transferred between each of the process chambers and the load lock via the corresponding vacuum transport chamber. The apparatus also includes load lock valves for switching between interrupt and opening between the load lock and the corresponding vacuum transport chambers, and process chamber valves for switching between interrupt and opening between the process chambers and the corresponding vacuum transport chambers. Timing for opening and closing the valves is controlled in synchronization with the transfer of the workpieces.