Vacuum Transport Module With Degas Sub-Chamber for Wafer Throughput
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Solution Overview
Problem
Existing semiconductor processing systems face challenges in maximizing throughput due to limitations in degassing capacity, particularly when handling substrates with organic passivation layers like polyimide and polybenzoxazole.
Innovation Solution
The apparatus includes a transport module with a vacuum chamber comprising a main chamber and a degas sub-chamber, each with dedicated pumping systems. The degas sub-chamber is sealed from the main chamber, allowing for continuous pumping and vacuum isolation, enhancing degassing efficiency and reducing contamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single vacuum chamber is used for both transport and degassing, then the system structure is simple, but the degassing capacity is limited and causes bottlenecks
Solution Approach 1:
The vacuum system is divided into two separate chambers: a transport chamber for moving wafers and a degas chamber for removing contaminants. This segmentation allows each chamber to be optimized for its specific function, with the degas chamber equipped with dedicated pumping systems and heating elements to handle high degassing loads without affecting transport operations.
Solution Approach 2:
The degassing function is extracted from the transport chamber and placed in a separate degas chamber. This extraction eliminates the bottleneck where degassing limited overall system throughput, as the transport chamber can now operate independently while the dedicated degas chamber handles contaminant removal with appropriate vacuum pumping and thermal processing.
2Productivity
If degassing is performed in the transport module, then productivity improves, but vacuum integrity and contamination risk are compromised
Solution Approach 1:
The system separates transport and degassing operations into distinct chambers connected by a transfer interface. The degas chamber can be vented to atmosphere during degassing operations without affecting the transport chamber vacuum, allowing aggressive thermal and vacuum processing while maintaining overall system vacuum integrity for continuous wafer transport.
Solution Approach 2:
A transfer interface or lock chamber acts as an intermediary between the atmosphere-exposed degas chamber and the vacuum-maintained transport chamber. This intermediary allows wafers to be transferred while maintaining vacuum isolation, enabling the degas chamber to be vented for loading/unloading without compromising transport chamber vacuum integrity.
3Productivity
If multiple process modules are added to increase throughput, then processing capability improves, but bottlenecks and idle time increase
Solution Approach 1:
The degas chamber serves multiple functions: it acts as a vacuum chamber for wafer transport, a degassing chamber with heating and pumping for contaminant removal, and a buffer chamber that can hold wafers while maintaining vacuum. This multi-functionality eliminates the need for separate dedicated degas modules, improving throughput by removing bottlenecks without adding proportional complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances system throughput by providing additional tool flexibility and reducing idle time, while also improving the degassing capacity and maintaining vacuum integrity, thus addressing the temperature sensitivity and contaminant removal challenges associated with organic passivation layers.
Implementation Method 1
removing the desorbed gases from the region where the wafer is heated, so that desorbed gases are not adsorbed back onto the wafer
Implementation Method 2
desorbed gases are not adsorbed back onto the wafer
Implementation Method 3
uniformly heating a wafer to a required temperature
Implementation Method 4
deposition methods occur at reduced pressure to maintain film quality by minimising the presence of unwanted contaminants
Data Source
AI summary
Apparatus for processing a semiconductor substrate having one or more semiconductor substrate handling devices through which a semiconductor substrate can be introduced to and/or removed from the apparatus, a plurality of process chambers for processing the semiconductor substrate; and a transport module for transporting the semiconductor substrate under vacuum conditions between the semiconductor substrate handling devices and the plurality of process chambers.