Vacuum Transport Platform Footprint Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor and LED substrate processing systems, tandem or quad process modules require large transport chambers due to the need for extensive footprints, which is costly and inefficient in micro-electronics fabrication environments.
Innovation Solution
A vacuum transport system with dual substrate transport robots and strategically placed isolation valves and load locks, allowing for simultaneous substrate processing and transfer between processing locations and load locks, thereby reducing the overall footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If tandem or quad process modules are used with only one or two modules, then substrate processing capacity is improved, but a large transport chamber is required resulting in large footprint
Solution Approach 1:
The patent combines multiple process modules (tandem or quad configuration) into a single integrated vacuum chamber, allowing substrates to be processed at multiple locations simultaneously without requiring separate transport chambers between modules. This merging eliminates the need for large inter-module transport spaces while maintaining high processing capacity
Solution Approach 2:
The patent arranges processing locations and load locks in a compact two-dimensional layout within the vacuum chamber, optimizing spatial utilization. By strategically positioning components in specific geometric arrangements, the system achieves high substrate processing capacity with minimized footprint
2Ease of operation
If a large transport chamber is provided to transport substrates between load locks and process modules, then substrate transport capability is improved, but footprint cost increases
Solution Approach 1:
The patent extracts the transport function from a separate large transport chamber and integrates it directly into the vacuum chamber workspace. Substrates are transported between load locks and process modules within the same vacuum environment, eliminating the need for dedicated large transport spaces while maintaining full transport capability
Solution Approach 2:
The vacuum chamber serves multiple functions simultaneously: it acts as both the processing environment and the transport pathway for substrates. The same chamber space used for substrate processing also facilitates substrate movement between load locks and process modules, eliminating the need for separate transport infrastructure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system efficiently transports substrates with a reduced footprint, optimizing space usage and operational efficiency in micro-electronics fabrication environments.
Implementation Method 1
A vacuum robot in the vacuum transport chamber may have a double articulated arm and may transport a substrate from a load lock to a process module and from the process module to the load lock
Data Source
AI summary
An apparatus has a vacuum transport chamber having first and second isolation valves coupled to first and second substrate processing locations, and third and fourth isolation valves coupled to a load lock. First and substrate transport vacuum robots are provided. The load lock is between the first and second substrate transport vacuum robots, and has an atmospheric isolation valve. The atmospheric isolation valve, the third and the fourth isolation valves are arranged in a spaced triangular relationship. The first substrate transport vacuum robot transports a processed substrate from the first processing location to the load lock and transports an unprocessed substrate from the load lock to the first processing location substantially simultaneously as the second substrate transport vacuum robot transports a different processed substrate from the second processing location to the load lock and transports a different unprocessed substrate from the load lock to the second processing location.