Vacuum Valve Pressure Mapping for Closing Alignment Detection

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Solution Overview

Problem

The semiconductor industry faces challenges with manual inspection of vacuum valves, which has poor resolution and disrupts automatic production lines, increasing the risk of wafer contamination due to misalignment and leakage.

Innovation Solution

An automatic system using a pressure monitoring tape with sensing elements to detect the closing condition of vacuum valves, providing real-time pressure data and alignment insights without interrupting the production line, utilizing capacitive, piezoresistive, or piezoelectric tactile sensors integrated with a data acquisition and processing unit.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If manual inspection of vacuum valves is performed to determine closing condition, then alignment and pressure can be assessed, but the resolution is poor and production line is interrupted

Engineering Contradiction:
Improveinspection resolutionVSAvoidproduction line throughput
Core Design Contradiction:
Measurement precisionVSProductivity

Solution Approach 1:

The patent replaces manual mechanical inspection with an automated sensing system that uses capacitive, piezoresistive, or piezoelectric sensors to detect valve closing conditions. This substitution eliminates human intervention while providing higher measurement precision through electronic sensing elements that can detect pressure and alignment with greater accuracy than manual methods.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The vacuum valve inspection system performs self-diagnosis by automatically detecting its own closing condition through integrated sensing elements. The system monitors its own alignment and pressure status without requiring external manual inspection, enabling continuous operation while maintaining quality control through automated feedback.

Inventive Principle:
Principle #25Self-service

2Reliability

If manual inspection of vacuum valves is performed, then closing condition can be determined, but wafer contamination risk increases due to production line interruption

Engineering Contradiction:
Improvevalve closing condition accuracyVSAvoidwafer contamination risk
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The automated sensing system enables continuous monitoring of vacuum valve closing conditions without interrupting the production line. The sensing elements remain integrated with the valve mechanism, allowing uninterrupted detection of alignment and pressure parameters while maintaining vacuum integrity and preventing wafer contamination through continuous rather than intermittent inspection.

Inventive Principle:
Principle #20Continuity of useful action

3Productivity

If automatic inspection system is implemented, then production line continuity is maintained, but system complexity increases

Engineering Contradiction:
Improveproduction line throughputVSAvoidinspection system complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The sensing system is designed to perform multiple functions: detecting valve alignment, measuring pressure differential, and determining closing condition accuracy all through a single integrated apparatus. The same capacitive, piezoresistive, or piezoelectric elements that detect valve position also sense pressure changes, eliminating the need for separate inspection devices and reducing overall system complexity despite the automated capability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively monitors vacuum valve alignment and pressure, preventing contamination by providing precise alignment data and triggering maintenance when necessary, ensuring continuous production with reduced contamination risks.

Implementation Method 1

utilizing capacitive, piezoresistive, or piezoelectric tactile sensors

Methodology Applied
Scientific EffectCapacitive sensing: Capacitance

Implementation Method 2

utilizing capacitive, piezoresistive, or piezoelectric tactile sensors

Methodology Applied
Scientific EffectPiezoresistive sensing: Piezoresistive Effect

Implementation Method 3

utilizing capacitive, piezoresistive, or piezoelectric tactile sensors

Methodology Applied
Scientific EffectPiezoelectric sensing: Piezoelectric Effect

Data Source

PatentUS20240361203A1System and method for monitoring vacuum valve closing condition in vacuum processing system
Publication Date: 2024.10.31 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20240361203A1 patent drawing
  • US20240361203A1 patent drawing
  • US20240361203A1 patent drawing

AI summary

A system and method for cleaning and inspecting ring frames is disclosed here. In one embodiment, a vacuum valve comprising at least one sealing O-ring; and a pressure monitoring tape on a mating surface on a vacuum processing chamber, wherein the pressure monitoring tape is configured to perform a pressure profile mapping between the mating surface on the vacuum processing chamber and a surface of the at least one sealing O-ring on the vacuum valve to determine a closing condition of the vacuum valve.