Vacuum Vapor Coating for Uniform Superconducting Coil Surfaces
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Solution Overview
Problem
Existing methods for constructing superconducting coils are limited to rectangular geometries, are costly, time-consuming, and lack flexibility in shape and size, leading to high production costs and complexity in magnetic applications.
Innovation Solution
A method and device for coating a surface using vapor deposition within a chamber, involving the placement of a structure inside the chamber, creating a vacuum, and injecting vapor while causing a relative motion, such as rotation, to uniformly coat surfaces, allowing for the formation of superconducting coils with various shapes and sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If superconducting coils are constructed by stacking rectangular tapes and shaping them into complex forms, then the magnetic field configuration can be achieved, but the production cost and time increase significantly
Solution Approach 1:
The patent replaces the mechanical process of stacking and shaping rectangular tapes with a direct vapor deposition process. Instead of mechanically assembling pre-formed tapes into complex coil shapes, the invention uses vapor-phase chemical reactions to directly deposit superconducting material onto substrates in the desired coil configuration, eliminating the time-consuming mechanical assembly steps while maintaining the ability to create complex magnetic field configurations
Solution Approach 2:
The invention changes the physical and chemical parameters of the deposition process by using vapor-phase precursors and controlling deposition conditions (temperature, pressure, flow rates) to directly form superconducting coils with specific geometries. This parameter-based control allows direct formation of complex shapes without mechanical shaping, reducing production time while achieving the required magnetic field configurations
2Ease of manufacture
If superconducting tapes are manufactured with fixed rectangular geometries, then the manufacturing process is simplified, but the flexibility in creating different coil shapes is limited
Solution Approach 1:
The patent replaces the mechanical cutting and shaping of rectangular tapes with a direct vapor deposition process that can create any coil geometry directly. The vapor deposition method allows the superconducting material to be deposited in the exact shape needed, eliminating the limitation of fixed rectangular geometries while maintaining manufacturing simplicity through a single-step direct formation process
Solution Approach 2:
The invention transitions from two-dimensional rectangular tape stacking to three-dimensional direct vapor deposition, allowing material to be deposited conformally on substrates to create complex coil geometries. This dimensional approach enables the formation of twisted, curved, and multi-layered coil structures that cannot be achieved by simply stacking flat rectangular tapes
3Adaptability or versatility
If complex coil shapes are created by cutting and twisting tapes, then the desired magnetic field configuration is achieved, but the design and testing complexity increases
Solution Approach 1:
The patent replaces the complex mechanical processes of cutting, twisting, and assembling tapes with a direct vapor deposition process. The deposition parameters (substrate positioning, precursor flow patterns, temperature gradients) can be programmed to directly create the desired coil geometry, reducing design complexity by eliminating multiple assembly steps and reducing testing complexity by minimizing potential defects from mechanical manipulation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and cost-effective production of superconducting coils with customizable configurations, reducing production time and costs, and facilitating quick changes in magnetic field configurations.
Implementation Method 1
injecting vapor through the at least one ejector towards the surface
Implementation Method 2
injecting vapor through the at least one ejector towards the surface
Implementation Method 3
forming a vacuum in the chamber
Data Source
AI summary
The present disclosure relates to a method for coating a surface (110B) of a structure (110), the method comprising steps of: —placing a structure (110) inside a chamber, at least one ejector (104) being located inside the chamber and oriented towards a surface (110B) to be coated of the structure; —enclosing the chamber; —forming a vacuum in the chamber; and then —injecting vapor through the at least one ejector (104) towards the surface, while causing a relative motion, for example rotation. between the structure and the at least one ejector.