Vacuum-Supported Vapor Reflow for Uniform Substrate Heating
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Solution Overview
Problem
Existing vapor phase soldering methods face challenges in uniformly transferring heat across substrates with miniaturized pitch, leading to bonding defects during solder reflow processes.
Innovation Solution
A solder reflow apparatus utilizing a vapor generating chamber with a substrate stage equipped with suction passages and vapor passages, along with a vacuum mechanism, to support and uniformly distribute heat through saturated vapor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If vapor phase soldering method is used, then uniform temperature distribution is achieved, but heat transfer uniformity deteriorates with miniaturized pitch
Solution Approach 1:
The substrate stage is divided into multiple regions with suction holes distributed across different areas. By segmenting the substrate support into zones corresponding to different pitch areas, the vacuum force can be selectively applied to maintain uniform contact pressure even when pitch dimensions vary, thereby maintaining heat transfer uniformity across miniaturized structures
Solution Approach 2:
The system dynamically adjusts the vacuum pressure parameter to compensate for miniaturized pitch effects. By changing the vacuum level and distribution, the substrate maintains optimal contact with the heating surface across varying pitch scales, ensuring consistent heat transfer performance despite reduced feature sizes
2Reliability
If substrate is firmly fixed to prevent bonding defects, then substrate stability is improved, but heat transfer uniformity deteriorates
Solution Approach 1:
Different regions of the substrate stage have locally optimized suction hole configurations. Areas with miniaturized pitch receive adjusted vacuum forces through localized suction hole patterns, providing just enough fixation to prevent bonding defects while preserving heat transfer uniformity in each specific region
Solution Approach 2:
The vacuum fixation system operates dynamically rather than statically. The vacuum pressure can be adjusted during the soldering process to maintain optimal balance between substrate stability for defect prevention and thermal contact quality for uniform heat transfer, adapting to real-time process conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures uniform heat transfer and secure substrate support, preventing bonding defects and enhancing the quality of solder joints.
Implementation Method 1
heating the heat transfer fluid to generate saturated vapor within the vapor generating chamber
Implementation Method 2
generating at least a partial vacuum in the suction holes to suction-support the substrate on the seating surface
Data Source
AI summary
A method of manufacturing an electronic device includes: providing a vapor generating chamber that accommodates a heat transfer fluid; providing a substrate stage within the vapor generating chamber, the substrate stage including a seating surface and suction passages penetrating the substrate stage to be open to the seating surface; loading a substrate on the substrate stage, wherein electronic components are disposed on the substrate via bumps; generating at least a partial vacuum in the suction holes to suction-support the substrate on the seating surface; heating the heat transfer fluid to generate saturated vapor within the vapor generating chamber; and soldering the bumps using the saturated vapor.