Vacuum Wafer Carrier for Thin Wafer Support
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Solution Overview
Problem
The challenge in the integrated circuit manufacturing industry is the difficulty in handling and strengthening thin wafers, which are prone to breakage during transportation and processes like CMP due to mechanical stress, and existing methods are limited by temperature sensitivity and chemical compatibility, or are costly and inefficient.
Innovation Solution
A vacuum wafer carrier apparatus with a base and a gas-penetration layer that creates a sealed gas passage, allowing the wafer to be supported by a vacuum environment, enabling mechanical support during various manufacturing processes without adhesives, thus avoiding thermal and chemical limitations and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive bonding is used to strengthen thin wafers, then mechanical support is improved, but temperature resistance and chemical compatibility deteriorate
Solution Approach 1:
The patent replaces adhesive bonding (chemical-mechanical system) with vacuum pressure (physical system). The wafer is held against the carrier substrate by vacuum pressure differential, eliminating the need for adhesives that have temperature and chemical limitations. This allows the system to withstand elevated temperatures and chemical exposure without degradation of the bonding mechanism.
Solution Approach 2:
The vacuum environment created by the gas-penetration layer and sealed gas passage provides an inert environment that protects both the wafer and carrier interface from chemical attacks. The vacuum prevents chemical reactions that would occur with adhesive-bonded systems, enabling use in wet etching and other chemically aggressive processes.
2Strength
If mobile electrostatic carrier is used to support thin wafers, then mechanical support is improved, but operational complexity and cost increase due to periodic recharging
Solution Approach 1:
The vacuum wafer carrier system is self-sustaining and does not require periodic external intervention for recharging or maintenance. Once vacuum is established through the gas-penetration layer, the system maintains wafer support automatically throughout the manufacturing process without needing external energy input or operator attention, unlike electrostatic carriers that require periodic recharging.
3Strength
If Teflon ring is clamped onto wafer edge for support, then mechanical support is improved, but process versatility deteriorates as CMP cannot be performed
Solution Approach 1:
The vacuum wafer carrier provides universal support that is compatible with multiple manufacturing processes including CMP, deposition, plating, and wet etching. The vacuum bonding interface does not interfere with any of these processes, whereas the Teflon ring physically blocks CMP tool access to the wafer surface. The carrier design allows the entire wafer surface to be accessible for all process steps.
4Device complexity
If thin wafers are handled without support, then device complexity is reduced, but reliability deteriorates due to breakage during transportation and processing
Solution Approach 1:
The vacuum wafer carrier acts as an intermediary between the wafer and the manufacturing equipment. It provides mechanical support and protection during transportation and processing while maintaining a simple interface for loading and unloading. The carrier absorbs the mechanical stresses that would otherwise be applied directly to the fragile thin wafer, preventing breakage without complicating the overall handling system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vacuum wafer carrier effectively supports thin wafers during transportation and manufacturing processes, preventing breakage and maintaining the wafers' integrity through a reusable, cost-effective solution that can withstand various process conditions.
Implementation Method 1
a vacuum wafer carrier includes a base, and a gas-penetration layer. The gas-penetration layer and a portion of the base directly underlying the gas-penetration layer form a gas passage therebetween
Data Source
AI summary
An apparatus for supporting a wafer includes a base, and a gas-penetration layer. The gas-penetration layer and a portion of the base directly underlying the gas-penetration layer form a gas passage therebetween. The gas passage is configured to be sealed by the wafer placed directly over the gas-penetration layer. The apparatus further includes a valve connected to the gas passage.