Vacuum Load Lock Wafer Clamp with Remote Sensor
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Solution Overview
Problem
Conventional semiconductor processing systems face challenges in securely handling wafers due to misalignment issues, leading to particle generation and high failure rates of electronic sensors from extreme temperature heating used to prevent condensation, which complicates the gripping and positioning of wafers during transitions between atmospheric and vacuum environments.
Innovation Solution
A workpiece clamp system with a cam ring and rotary clamps, actuated by a linear mechanism, that allows for secure clamping and remote sensing of the workpiece outside the isolated environment, using sensors positioned outside the vacuum to prevent sensor failure and misalignment, with a sealing mechanism to maintain environmental integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If high temperature heating is applied to prevent condensation on cooled wafers, then condensation is prevented, but electronic sensors fail due to high temperatures
Solution Approach 1:
The sensing function is extracted from the vacuum chamber environment and placed in the atmospheric environment. The atmospheric sensor detects wafer presence through the chamber wall, eliminating exposure to high temperatures and condensation risks inside the vacuum chamber while maintaining condensation prevention capabilities.
Solution Approach 2:
The chamber wall acts as an intermediary medium that transmits sensor detection signals from the atmospheric side to the vacuum side. This allows sensing without direct exposure to harsh vacuum chamber conditions including high temperatures and condensation.
2Force
If grippers are positioned close to the wafer for secure clamping, then gripping force is improved, but misalignment causes particle generation
Solution Approach 1:
Mechanical alignment adjustments are replaced with a magnetic field-based positioning system. The magnetic field provides precise alignment of the wafer with the grippers without requiring complex mechanical adjustments, reducing misalignment and particle generation while maintaining secure gripping force.
3Manufacturing precision
If multiple adjustable components are used for gripper and pin alignment, then positioning precision is improved, but system complexity increases
Solution Approach 1:
Complex mechanical adjustment mechanisms for aligning grippers and pins are replaced with a magnetic field-based positioning system. The magnetic field automatically aligns components with high precision without requiring multiple adjustable mechanical parts, reducing system complexity while maintaining alignment precision.
Solution Approach 2:
The positioning system transitions from mechanical parameter adjustments (physical positions of multiple components) to magnetic field parameter control. By controlling magnetic field strength and distribution, precise alignment is achieved with fewer physical adjustment mechanisms.
Data Source
AI summary
A workpiece clamp has a base with first and second sides with a cam ring rotatably coupled to the first side. The cam ring has plurality of cam slots. An actuator selectively rotates the cam ring with respect to the base. A plurality of rotary clamps, have respective shafts, cam followers assemblies, and workpiece engagement members, where the shaft extends through the base from the first to second side and rotate about an axis. The shaft has individually rotatable first and second members. The cam follower assemblies couple first and second portions of the shaft, where a cam follower is radially offset from the shaft axis and configured to engage a respective cam slot. The workpiece engagement member has a gripper member that is radially offset from the shaft axis and is configured to engage a workpiece based on a position of the cam follower in the respective cam slots. Sensors are positioned on the first side of the base, wherein each sensor detects a rotational position of the first and second members, thus determining a clamping state of each rotary clamp.