Vacuum Laser Protection Window Transfer for Continuous Machining

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Solution Overview

Problem

The existing laser machining processes for organic light emitting displays face inefficiencies due to the accumulation of particles on the protection window of the laser apparatus, which requires frequent cleaning or replacement, disrupting the vacuum environment and reducing production efficiency.

Innovation Solution

A laser apparatus with a first vacuum chamber, a laser, a carrier, and a transfer unit that allows for the automatic transfer of a first protection window to a second vacuum chamber for cleaning or replacement without opening the first vacuum chamber, maintaining the high vacuum environment and enhancing production efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the protection window is cleaned or replaced by opening the vacuum chamber, then the particles on the protection window can be removed, but the vacuum environment is disrupted and production efficiency is reduced

Engineering Contradiction:
Improveprotection window cleanlinessVSAvoidproduction efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The protection window is segmented from the vacuum chamber, allowing it to be removed and replaced independently without opening the chamber. The transfer chamber provides a separate environment for handling protection windows, enabling maintenance operations to be decoupled from the main vacuum process.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A transfer chamber acts as an intermediary between the vacuum chamber and the external environment. This intermediate space allows protection windows to be transferred in and out of the vacuum chamber without direct exposure to atmospheric conditions, maintaining vacuum integrity during maintenance operations.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of operation

If the vacuum chamber is opened for protection window replacement, then the protection window can be accessed for cleaning, but the high vacuum environment is lost and substrates are exposed to moisture and oxygen

Engineering Contradiction:
Improveprotection window accessibilityVSAvoidmoisture and oxygen exposure
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The transfer chamber provides a controlled environment that maintains vacuum conditions during protection window handling. By keeping the transfer chamber under vacuum or inert atmosphere, substrates in the vacuum chamber remain protected from moisture and oxygen even when the protection window is being replaced.

Inventive Principle:
Principle #39Inert atmosphere (Inert environment)

Solution Approach 2:

The transfer chamber serves as an intermediary space that isolates the vacuum chamber from atmospheric exposure during protection window maintenance. This intermediate environment allows operational access to the protection window while preventing harmful factors from reaching the substrates.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Productivity

If the protection window is not replaced frequently, then production efficiency is maintained, but particles accumulate on the protection window and affect laser machining quality

Engineering Contradiction:
Improveproduction efficiencyVSAvoidlaser machining quality
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The system transitions from a static protection window to a dynamic, replaceable one. The transfer mechanism enables the protection window to be dynamically exchanged based on contamination levels, allowing optimization between production efficiency and machining quality by replacing windows at appropriate intervals without chamber opening.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

Multiple protection windows can be prepared in advance in the transfer chamber. When one window becomes contaminated, a pre-prepared clean window is already available for immediate replacement, minimizing downtime and maintaining both production efficiency and machining quality.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables continuous laser machining in a high vacuum environment without interrupting the process, minimizing the impact of moisture and oxygen on the substrates, and increasing the reliability of the organic light emitting displays by maintaining production efficiency.

Implementation Method 1

a laser beam emitted by the laser passes through the chamber window and the first protection window, and is emitted to one surface of the target substrate

Methodology Applied
Scientific EffectLight transmission: Light

Implementation Method 2

a high vacuum environment of a chamber is used when laser machining is performed on a substrate (SUB) of an organic light emitting display

Methodology Applied
Scientific EffectVacuum: Vacuum

Data Source

PatentUS20250025964A1Laser apparatus and laser machining method
Publication Date: 2025.01.23 SAMSUNG DISPLAY CO LTD
  • US20250025964A1 patent drawing
  • US20250025964A1 patent drawing
  • US20250025964A1 patent drawing

AI summary

A laser apparatus includes: a first vacuum chamber, wherein machining is performed on a target substrate in the first vacuum chamber; a laser facing the first vacuum chamber; a carrier disposed in the first vacuum chamber, wherein the target substrate is seated on the carrier; a chamber window disposed in one surface of the first vacuum chamber, wherein a laser beam emitted by the laser passes through the chamber window; a first protection window positioned between the carrier and the chamber window; a second vacuum chamber disposed at a first side of the first vacuum chamber; and a transfer unit configured to transfer the first protection window to the second vacuum chamber.