3D Electronic Module Manufacturing Using Validated PCB Panels
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Solution Overview
Problem
The existing processes for manufacturing 3D electronic modules face challenges in achieving high yield and efficiency with multiple redistribution layers, as the performance of redistribution layers (RDL) drops significantly with increasing levels, often resulting in incomplete connections and defective modules.
Innovation Solution
A process involving the collective manufacture of 3D electronic modules using validated reconstituted wafers (KGRWs) and printed circuit boards (PCBs) with multiple interconnection levels, where a panel of validated PCBs (KGRPs) is created and bonded with the wafers, followed by cutting to form 3D modules, ensuring high precision and yield by using techniques like engraving and polymerization of epoxy resin with glass fibers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of redistribution layers (RDL) is increased to achieve more connection levels, then the connectivity and interconnection capability are improved, but the manufacturing yield and efficiency deteriorate rapidly due to performance drop with increasing levels
Solution Approach 1:
The patent divides the interconnection system into two separate segments: validated PCBs (KGRPs) that provide multiple connection levels (6-10 levels) and reconstituted wafers (KGRWs) that provide active components. This segmentation allows each component to be optimized independently - PCBs for high-level connectivity with validated yield, and wafers for active component functionality - thereby resolving the contradiction between achieving multiple connection levels and maintaining manufacturing yield.
2Adaptability or versatility
If validated PCBs with multiple interconnection levels (6-10 levels) are used to ensure high connectivity, then the interconnection capability is improved, but the device complexity and manufacturing process complexity increase
Solution Approach 1:
The patent applies preliminary action by pre-validating PCBs through electrical testing before they are assembled into the final 3D module. PCBs are manufactured, tested, and validated in advance to create a library of known-good units (KGRPs). This preliminary validation eliminates the need for complex testing and validation during final assembly, reducing manufacturing process complexity while maintaining high interconnection capability.
Solution Approach 2:
The validated PCB acts as an intermediary component between the reconstituted wafers and the external environment. It provides the multiple interconnection levels (6-10 levels) needed for complex connectivity while isolating the active components in the wafers from the complexity of multi-level routing. This intermediary approach simplifies the overall manufacturing process by separating the complexity of interconnection from the complexity of active component integration.
3Reliability
If reconstituted wafers (KGRWs) with only validated components are used to improve yield, then the component reliability is improved, but the overall manufacturing yield deteriorates when combined with existing RDL processes due to performance drop at multiple levels
Solution Approach 1:
The patent merges two independently validated systems: validated PCBs (KGRPs) with proven interconnection capability and reconstituted wafers (KGRWs) with validated active components. By combining these two validated elements, the overall manufacturing yield is improved because both components bring their own validation history. The validated PCB provides multiple interconnection levels without the performance degradation associated with traditional multi-level RDL processes, while the validated wafers provide reliable active components, together achieving high overall yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the overall yield and connectivity of 3D electronic modules by maintaining high efficiency even with multiple interconnection levels, reducing leakage currents and improving the intrinsic yield of the modules, while ensuring reliable electrical connections.
Implementation Method 1
molding of the transferred circuits in an electrically insulating resin of the epoxy type, called coating resin and polymerization of the resin
Implementation Method 2
transfer of printed circuits validated at the end of this test on an adhesive support
Data Source
Figure 1~2b
Figure 3a~3d
Figure 3e~3f
AI summary
The invention relates to a collective manufacturing process for 3D electronic modules which includes: - the manufacture of a stack (100) of reconstituted boards, comprising validated active components (11), this stack including a redistribution layer (30), - the manufacture of a panel of validated passive printed circuits (200) which includes the following sub-steps: o manufacture of a printed circuit board panel, o electrical testing of each printed circuit board, o transfer of the validated printed circuits onto an adhesive support (8'), o molding of the transferred circuits in an electrically insulating resin (6), called the encapsulation resin and polymerization of the resin, o removal of the adhesive support, a panel comprising only validated printed circuits being thus obtained, - a step of gluing the panel with a stack of reconstituted boards, - a step of cutting the assembly in order to obtain the 3D electronic modules.