Valve Box Module Automated Purge Control for Semiconductor Tools
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Solution Overview
Problem
Current semiconductor manufacturing systems require manual and inefficient purge cycles before detaching tools from a valve manifold box, which can lead to inconsistencies and increased risk during the detachment process.
Innovation Solution
A semiconductor device manufacturing system that automates the purge process using a valve box module with a pneumatic valve and pressure transmitter, controlled by a programmable logic controller, to manage the flow of purge gas into sticks connected to semiconductor manufacturing tools, ensuring efficient and reliable purging by maintaining specific pressure values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual purge cycles are used before tool detachment, then the purge process can be performed, but the process is inefficient and inconsistent
Solution Approach 1:
The system enables automatic purge cycles where the valve box module autonomously controls purge gas flow to sticks based on tool detachment signals, eliminating manual intervention and ensuring consistent execution of purge procedures
Solution Approach 2:
The system incorporates pressure transmitters that monitor pressure within sticks and provide feedback to the controller, which adjusts valve operations to maintain pressure within specified ranges, ensuring reliable and consistent purging
2Reliability
If automated purge control is implemented with pressure transmitters and pneumatic valves, then purge consistency is improved, but device complexity increases
Solution Approach 1:
The valve box module integrates multiple functions including purge gas distribution, pressure monitoring, and automated valve control within a single unified system, allowing one component to perform multiple roles and reducing overall system complexity
Solution Approach 2:
The system combines the purge gas supply system, pressure transmission sensors, and pneumatic valve control into an integrated automated purge control system, merging previously separate functions into a coordinated unified mechanism
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables instant and efficient purging of sticks before tool detachment, improving the safety and accuracy of the process by automating the purge cycle and maintaining consistent pressure, thus enhancing the reliability of semiconductor manufacturing operations.
Implementation Method 1
a first pressure transmitter downstream of the first pneumatic valve and configured to detect a pressure value in the first gas line
Implementation Method 2
a first pneumatic valve in the first gas line and configured to control the flow of the purge gas into the at least one stick
Data Source
AI summary
A semiconductor device manufacturing system and a method for manufacturing semiconductor device are provided. The semiconductor device manufacturing system comprises a valve box module, a controller, a purge gas source and at least one semiconductor manufacturing tool. The valve box module includes at least one stick and a first gas line in fluid communication with the at least one stick. Further, the first gas line includes a pneumatic valve and a pressure transmitter downstream of the pneumatic valve. The controller connects to the pneumatic valve and the pressure transmitter of the first gas line. The purge gas source is in fluid communication with the first gas line. The at least one semiconductor manufacturing tool is coupled to the at least one stick.