Valve Assembly Cooling Module for Solenoid Heat Control

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Solution Overview

Problem

Existing valve assemblies face functional impairments due to high operating temperatures, which can affect operational safety, particularly due to heat generation from electronic components and solenoid valves.

Innovation Solution

Incorporating a cooling module with a cooling channel structure that diverts fluidic pressure medium from collecting fluid channels into a communication channel to cool electronic components, using the same fluid medium for both venting and cooling purposes, with temperature-controlled shut-off valves to manage cooling flow.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If electronic components and solenoid valves are used in the valve assembly, then the functionality and control capability are improved, but high operating temperatures are generated which can cause functional impairments and affect operational safety

Engineering Contradiction:
Improvecontrol capabilityVSAvoidoperating temperature
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent converts the harmful heat generated by electronic components and solenoid valves into a beneficial cooling function. The fluidic pressure medium, which would normally just be vented through the collecting fluid channel, is instead directed through a cooling channel to cool electronic components in the communication string. This transforms the waste heat problem into an active thermal management solution, allowing the system to handle higher temperatures without functional impairments

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

2Temperature

If additional cooling systems are introduced to manage heat, then temperature control is improved, but the device complexity and number of components increase

Engineering Contradiction:
Improvetemperature controlVSAvoidsystem complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the cooling function with the existing fluid distribution system by integrating a cooling channel into the valve support structure. The cooling channel is formed as part of the valve support body and uses the same fluidic pressure medium that is already present in the system for actuating the directional valves. This eliminates the need for separate cooling systems, additional fluid lines, or external coolant loops, thereby avoiding increased device complexity while achieving effective temperature control

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The fluidic pressure medium serves multiple functions simultaneously: it acts as the actuating medium for the directional valves through the collecting fluid channel, and as a cooling medium for the electronic components through the cooling channel. The communication string is thus served dual purposes - electrical signal transmission and thermal management - without requiring additional dedicated systems for each function

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively cools electronic components, preventing functional impairments even at excessive heat levels, ensuring operational reliability and safety without additional fluid lines or protection measures.

Implementation Method 1

a fluidic connection between at least one collecting fluid channel of the valve support fluid channels, opening out at the cooling module-mounting point, and the communication channel is or can be provided, through which fluidic pressure medium diverted from the collecting fluid channel can be fed into the communication channel by executing a cooling flow as a cooling medium for cooling the at least one electronic component of the electrical communication string

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS20250207678A1Valve arrangement
Publication Date: 2025.06.26 FESTO AG & CO KG
  • US20250207678A1 patent drawing
  • US20250207678A1 patent drawing
  • US20250207678A1 patent drawing

AI summary

A valve arrangement containing a valve assembly, such valve assembly having a valve support, such valve support having valve mounting points which are mounted with electrically actuable directional valves. A plurality of valve support fluid channels are designed in the valve support, which at least in part open out at each valve mounting point and are fluidically connected to each directional valve. A communication channel is also designed in the valve support, in which a communication string having at least one electronic component is arranged, with which the mounted directional valves make electrical contact to enable their electrical control. At least one collecting fluid channel also opens out at a cooling module mounting point of the valve support, on which a cooling module is mounted. The cooling module is penetrated by a cooling channel structure, which provides a fluidic connection between the collecting fluid channel and the communication channel.