Valve-Controlled Impingement Cooling for IC Hotspot Control

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Solution Overview

Problem

Conventional liquid cooling structures are inadequate for effectively managing and controlling the temperature of active regions in integrated circuits due to their static coolant flow paths, which are less effective in transferring heat from dynamically changing and spatially varying thermal energy distributions.

Innovation Solution

A liquid cooling structure with dynamically adjustable coolant flow volume and impingement openings positioned over active regions of integrated circuits, controlled by valves to directly impinge coolant on overheating areas, utilizing thermal sensors and logic signals for precise temperature control and reducing the number of impingement openings, utilizing thermal sensors and logic signals for precise temperature control and impingement openings, utilizing thermal sensors and logic signals for precise temperature control.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional liquid cooling structures with static coolant flow paths are used, then the cooling system is simple to manufacture, but the heat transfer efficiency is insufficient for dynamically changing thermal energy distributions

Engineering Contradiction:
Improvecooling system simplicityVSAvoidheat transfer efficiency
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent implements dynamic coolant flow control by positioning impingement openings over active regions and using valves to adjust coolant flow volume in response to thermal energy distribution changes. This allows the cooling system to adapt to dynamically changing thermal patterns, improving heat transfer efficiency while maintaining manufacturability through a modular valve-controlled architecture.

Inventive Principle:
Principle #15Dynamics

2Device complexity

If coolant flow is directed to all regions uniformly, then the cooling structure is simple, but thermal energy cannot be effectively controlled in specific active regions

Engineering Contradiction:
Improvecooling structure simplicityVSAvoidtemperature control precision
Core Design Contradiction:
Device complexityVSMeasurement precision

Solution Approach 1:

The patent applies local quality by positioning impingement openings specifically over active regions rather than uniformly distributing cooling across all regions. Valves are used to control coolant flow to specific local areas, enabling precise temperature control in thermally active zones while keeping the overall cooling structure relatively simple.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The cooling system is segmented into multiple controllable regions with individual valves that can independently adjust coolant flow. This segmentation allows precise temperature control in specific active regions while maintaining overall system simplicity through modular, independent control units.

Inventive Principle:
Principle #1Segmentation

3Ease of operation

If static coolant flow paths are used, then the system is easy to operate, but it cannot adapt to dynamically changing active regions

Engineering Contradiction:
Improvecooling system operation simplicityVSAvoidadaptation to thermal changes
Core Design Contradiction:
Ease of operationVSAdaptability or versatility

Solution Approach 1:

The system maintains ease of operation through automated valve control based on thermal feedback, while achieving adaptability by dynamically adjusting coolant flow distribution in response to changing thermal energy patterns. The automated control mechanism ensures simplicity of operation without sacrificing adaptability.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances heat transfer efficiency by directly impinging coolant on active regions, dynamically adjusting coolant flow, and reducing thermal energy buildup, thereby preventing circuit inefficiencies and potential failures.

Implementation Method 1

Liquid cooling structures are positioned on or near integrated devices in order to more effectively transfer heat away from the integrated device

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

The plurality of valves are actuated to direct the liquid coolant to flow towards and impinge on specific openings of the plurality of openings that are over an active region of the integrated device

Methodology Applied
Scientific EffectForced Convection: Forced Convection

Data Source

PatentUS20250351293A1Dynamic liquid cooling for integrated device
Publication Date: 2025.11.13 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20250351293A1 patent drawing
  • US20250351293A1 patent drawing
  • US20250351293A1 patent drawing

AI summary

Some embodiments relate to an integrated circuit cooling system including: an impingement coolant block overlying a semiconductor die; an inlet opening in the impingement coolant block and coupled to an inlet; a plurality of tubes extending in a first direction directly beneath the inlet opening and having first ends and second ends, where the plurality of tubes are respectively centered on first axes; a plurality of valves coupling the first ends of the plurality of tubes to the inlet opening; a plurality of impingement openings within the impingement coolant block and respectively surrounding the second ends of the second plurality of tubes, where the plurality of impingement openings are respectively centered on the first axes; and an outlet opening within the impingement coolant block and between the inlet opening and the plurality of impingement openings, the outlet opening physically coupling the plurality of impingement openings to an outlet.