Valve-Actuated Partition for Liquid Flow Resistance in Heat Dissipation

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Solution Overview

Problem

Existing water-cooled heat dissipation assemblies face inefficiencies due to excessive flow resistance caused by uneven flow paths, leading to non-smooth liquid flow and reduced heat dissipation effectiveness in high-power computing environments.

Innovation Solution

A heat dissipation assembly with a partition structure and valve mechanism that adjusts fluid pressure between flow paths, allowing liquid diversion from one path to another to reduce resistance and enhance flow smoothness, thereby accelerating heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If liquid flows from a wider flow path to a narrower flow path, then heat dissipation capability is improved, but flow resistance increases excessively

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidflow resistance
Core Design Contradiction:
TemperatureVSStress or pressure

Solution Approach 1:

The partition wall is designed to be movable rather than fixed, allowing it to dynamically adjust its position in response to fluid pressure differences. This enables the system to adapt the flow path configuration in real-time, balancing heat dissipation needs with acceptable flow resistance levels

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system changes the physical state of the partition wall from fixed to movable, allowing parameter changes in the flow path configuration. The partition wall's position can be adjusted based on operating conditions to optimize both heat dissipation and flow characteristics

Inventive Principle:
Principle #35Parameter changes

2Productivity

If the flow rate of cooling liquid is increased, then heat conduction capability is improved, but flow resistance becomes excessive

Engineering Contradiction:
Improveheat conduction capabilityVSAvoidflow resistance
Core Design Contradiction:
ProductivityVSStress or pressure

Solution Approach 1:

The movable partition wall creates a dynamic flow path configuration that responds to increased flow rates by adjusting to reduce resistance, allowing higher productivity without proportional increases in flow resistance

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The flow path is segmented by the partition wall into multiple sections, allowing independent optimization of different flow regions. This segmentation enables better control over fluid distribution and reduces overall flow resistance

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces fluid pressure and improves heat dissipation efficiency by allowing smooth liquid flow and advancing partial fluid circulation, addressing the issue of excessive flow resistance and enhancing cooling performance.

Implementation Method 1

When a fluid pressure existed in a section of one of the first flow path and the second flow path which is adjacent to the valve structure is greater than a fluid pressure existed in a section of the other one of the first flow path and the second flow path which is adjacent to the valve structure, the valve structure is pushed away to expose at least a part of the breach

Methodology Applied
Scientific EffectFluid pressure: Pressure Gradient

Implementation Method 2

a water-cooled heat dissipation assembly is one of the common heat dissipation methods, mainly absorbs the heat energy of a heat source (such as a motherboard, a central processing unit or a display chip) via liquid, then discharges the heat-absorbed liquid for heat exchange cooling

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS11448331B2Heat dissipation assembly
Publication Date: 2022.09.20 GIGA BYTE TECH CO LTD
  • US11448331B2 patent drawing
  • US11448331B2 patent drawing
  • US11448331B2 patent drawing

AI summary

A heat dissipation assembly includes a case and a partition structure. The case has a chamber. The partition structure includes a partition wall vertically disposed in the chamber to separate a first flow path and a second flow path in the chamber, and the partition wall has a breach and a valve structure disposed at the breach, wherein the valve structure covers the breach when the valve structure is not pushed open. When a fluid pressure existed in a section of one of the first flow path and the second flow path which is adjacent to the valve structure is greater than a fluid pressure existed in a section of the other one of the first flow path and the second flow path which is adjacent to the valve structure, the valve structure is pushed away to expose at least a part of the breach.