Integrated Valve Plate Wafer Transfer for Vacuum Chamber Switching
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Solution Overview
Problem
The existing wafer transfer process in semiconductor inspection devices is cumbersome and inefficient, involving complex operations between the loadlock chamber and the main vacuum chamber.
Innovation Solution
A wafer transfer apparatus with a valve plate piping system driven by a drive mechanism, allowing the valve plate to move between positions to switch the state of chambers, integrating wafer transfer with chamber communication or isolation, utilizing a sealing assembly and vacuum pumping module for efficient operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the existing wafer transfer process is used with separate loadlock chamber and main vacuum chamber operations, then the chambers can be independently controlled, but the transfer process becomes cumbersome and inefficient
Solution Approach 1:
The patent combines the chamber isolation valve and wafer transfer platform into a single integrated valve plate structure. The valve plate serves dual functions: it acts as a sealing valve to isolate chambers and as a transfer platform to carry wafers. This merging eliminates the need for separate operations of valve control and platform positioning, thereby simplifying the transfer process and improving efficiency while maintaining independent chamber control capability
Solution Approach 2:
The valve plate is designed as a multi-functional component that simultaneously performs chamber isolation and wafer transfer functions. By making the valve plate movable between different positions, it can seal the communication passage between chambers or serve as a transfer platform, allowing a single component to handle multiple tasks that previously required separate mechanisms
2Ease of operation
If the valve plate piping moves to switch chamber states, then wafer transfer is synchronized with chamber communication or isolation, but the sealing requirement during movement becomes more challenging
Solution Approach 1:
The patent employs dynamic sealing solutions to address the sealing challenge during valve plate movement. The sealing structure is designed to adapt to the moving valve plate, maintaining reliable sealing both when the plate is stationary at isolated/communicated positions and during the transition between positions. This dynamic approach ensures sealing reliability is maintained throughout the entire operation cycle while enabling the simplified synchronized transfer process
Data Source
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AI summary
The present application belongs to the technical field of handling devices, and specifically relates to a wafer transfer device and a semiconductor inspection apparatus. The wafer transfer device comprises a valve plate pipeline, a transmission mechanism and a carrier seat, wherein the valve plate pipeline comprises a valve plate and a pipeline extending from the valve plate in a first direction; the carrier seat is connected to the valve plate and, in the first direction, located on the side of the valve plate away from the transmission mechanism; and the transmission mechanism is connected to the pipeline, and the transmission mechanism is configured to be capable of driving the valve plate pipeline to move in the first direction, so as to adjust the positions of the valve plate and the carrier seat in the first direction. By means of the transmission mechanism driving the valve plate pipeline to move in the first direction, the position of the valve plate in the first direction is shifted, allowing two cavities to switch between a disconnected state and a connected state. In addition, the carrier seat for placing a silicon wafer is arranged on the valve plate; when the valve plate moves in the first direction in order to switch the state of the two cavities, the valve plate is integrated with the carrier seat thus synchronously handling the silicon wafer.