Valveless Liquid Supply Nozzle for Semiconductor Substrate Cleaning
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Solution Overview
Problem
The existing liquid treatment processes for substrates in semiconductor fabrication generate contaminants and particles due to the operation of valves in liquid supply lines, leading to inefficiencies and failures in the cleaning process.
Innovation Solution
An apparatus and method that minimize particle production by eliminating valves between the branch point and nozzle in the liquid supply line, using a curved downstream area with sensors to control liquid flow and pressure, and incorporating a buffer to manage liquid levels and prevent backflow, ensuring purified liquid delivery to the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a valve is mounted in the liquid supply line to control liquid flow, then the liquid supply can be opened or closed, but particles are generated due to diaphragm collision
Solution Approach 1:
The patent removes the valve from the liquid supply line that delivers liquid to the nozzle, extracting the source of particle generation from the critical liquid delivery path. The valve is retained in the discharge line for draining purposes, but the harmful valve-diaphragm collision occurs away from the substrate treatment area, preventing particle contamination of the liquid supplied to the substrate.
2Ease of operation
If the liquid supply line is made long to reach the substrate, then liquid can be supplied to the substrate, but particles are more likely to be generated and accumulated
Solution Approach 1:
The patent shortens the liquid supply line by removing the valve section from the path between the liquid source and the nozzle. This extraction reduces the length of the liquid supply line and eliminates the collision zone where particles are generated, thereby reducing particle accumulation in the liquid that reaches the substrate.
3Productivity
If a valve is used to stop liquid supply, then liquid flow can be controlled, but the collision process generates contaminants
Solution Approach 1:
The patent extracts the valve from the liquid supply line and relocates it to the discharge line. The valve retention in the discharge line allows for controlled draining and supply stopping when needed, while the critical liquid supply path to the substrate remains valve-free, preventing contaminant generation during normal substrate treatment operations.
Data Source
AI summary
An apparatus and a method for performing liquid treatment for a substrate are provided. The apparatus for treating the substrate includes a treating container having a treatment space inside the treating container, a substrate support unit to support a substrate in the treatment space, and a liquid supply unit to supply treatment liquid to the substrate supported by the substrate support unit. The liquid supply unit includes a nozzle, a supply line to supply the treatment liquid to the nozzle and having a first valve mounted in the supply line, and a discharge line branching from a branch point which is a point downstream of the first valve in the supply line to discharge the treatment liquid from the supply line, and having a second valve mounted in the discharge line. A valve is absent in an area between the branch point and the nozzle, in the supply line.