Vanadium Compound for High-Temperature ALD Thin Films

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Solution Overview

Problem

Conventional vanadium compounds used in chemical vapor deposition for forming thin films have low thermal decomposition temperatures, making it difficult to achieve high-quality films with minimal carbon residue, especially when applying the Atomic Layer Deposition (ALD) method which requires temperatures of 300°C or more.

Innovation Solution

A vanadium compound represented by General Formula (1), where R1 is a linear or branched alkyl group with 1 to 7 carbon atoms and n is 2 to 4, is used as a raw material for forming thin films, offering a thermal decomposition temperature of 300°C or more and preventing spontaneous combustion, thus suitable for ALD methods.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional vanadium compounds are used as raw materials for chemical vapor deposition, then the deposition process can be performed, but the thermal decomposition temperature is low making it difficult to form high-quality thin films with minimal carbon residue

Engineering Contradiction:
Improvethin film qualityVSAvoidthermal decomposition temperature
Core Design Contradiction:
Manufacturing precisionVSTemperature

Solution Approach 1:

The patent applies parameter changes by modifying the molecular structure of vanadium compounds - specifically using vanadium compounds with alkyl groups having 1-7 carbon atoms instead of conventional compounds. This structural parameter change increases the thermal decomposition temperature to 300°C or higher, enabling high-quality thin film formation with minimal carbon residue while maintaining suitability for ALD and CVD methods

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If heating at 300°C or more is performed to form high-quality thin film by ALD method, then film quality improves, but conventional vanadium compounds decompose at low temperatures making them unsuitable

Engineering Contradiction:
Improvethin film qualityVSAvoidsuitability for ALD method
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The invention changes the thermal stability parameter of vanadium compounds by selecting specific alkyl group structures (1-7 carbon atoms). This enables the compound to withstand ALD process temperatures of 300°C or higher without premature decomposition, while still maintaining reactivity for effective film formation. The compound achieves both high thermal stability and ALD method suitability

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent achieves local quality by optimizing specific molecular characteristics - the alkyl group structure - to provide the right balance of thermal stability and reactivity. This localized structural optimization enables the compound to perform well specifically in ALD processes requiring high temperature stability, while remaining adaptable to CVD methods as well

Inventive Principle:
Principle #3Local quality

3Ease of manufacture

If vanadium compound with low thermal decomposition temperature is used, then easier deposition is achieved, but carbon residue increases reducing film quality

Engineering Contradiction:
Improvedeposition easeVSAvoidcarbon residue
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent changes the thermal decomposition temperature parameter from low (conventional) to high (300°C or higher) by selecting vanadium compounds with specific alkyl group structures. This parameter change simultaneously achieves both goals: the compound remains easy to use in deposition processes while producing minimal carbon residue, thereby improving film quality without sacrificing ease of manufacture

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The vanadium compound enables the formation of high-quality thin films with reduced carbon residue, suitable for both CVD and ALD methods, ensuring thermal stability and broad ALD windows, resulting in smooth films with minimal thickness variations.

Implementation Method 1

a thermal decomposition temperature of 300° C. or more

Methodology Applied
Scientific EffectThermal decomposition: Pyrolysis

Implementation Method 2

introducing a vapor including a vanadium compound, which is obtained by vaporizing a raw material for forming a thin film

Methodology Applied
Scientific EffectVaporization: Evaporation

Implementation Method 3

forming, on a surface of the substrate, a thin film including vanadium atoms by inducing decomposition and/or chemical reaction of the vanadium compound

Methodology Applied
Scientific EffectChemical vapor deposition: Chemical Vapour Deposition

Data Source

PatentUS10882874B2Vanadium compound
Publication Date: 2021.01.05 ADEKA CORP
  • US10882874B2 patent drawing
  • US10882874B2 patent drawing
  • US10882874B2 patent drawing

AI summary

A vanadium compound represented by following General Formula (1).In General Formula (1), R1 represents a linear or branched alkyl group having 1 to 7 carbon atoms and n represents a number from 2 to 4. R1 preferably represents a secondary alkyl or a tertiary alkyl. It is preferred that in General Formula (1), n is 2 and R1 is tert-butyl group or tert-pentyl group, since the compound has a broad ALD window and high thermal decomposition temperature to be able to form a good quality vanadium-containing thin film that has a small carbon residue when used as an ALD material.