Vanadium Dioxide Composite for Tunable Heat Storage Conductivity
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Solution Overview
Problem
Conventional solid heat storage materials, such as vanadium dioxide, suffer from low thermal conductivity, which limits their effectiveness in heat dissipation and storage, leading to excessive temperature rises in electronic devices.
Innovation Solution
A solid heat storage material composed of vanadium dioxide bonded with a highly thermally conductive substance, such as copper, with a volume fraction of 0.03 or more, ensuring close and dense adhesion without diffusion or reaction phases, and oriented for optimal heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vanadium dioxide is used as a solid heat storage material, then latent heat storage performance is achieved without liquid leakage, but thermal conductivity is too low (approximately 6 W/mK) for effective heat dissipation
Solution Approach 1:
The patent creates a composite material by bonding vanadium dioxide particles to a highly thermally conductive substance (such as copper, silver, or aluminum) with a volume fraction of 0.03 or more. This composite structure combines the latent heat storage capability of vanadium dioxide with the high thermal conductivity of the metal substance, achieving both reliability in heat storage and improved thermal conductivity for effective heat dissipation.
2Temperature
If the thermal conductivity of vanadium dioxide is increased by adding highly thermally conductive substance, then heat dissipation performance is improved, but the material composition and structure become more complex
Solution Approach 1:
The patent optimizes the volume fraction of the highly thermally conductive substance to 0.03 or more, which is sufficient to significantly improve thermal conductivity while maintaining a relatively simple composite structure. This parameter optimization achieves effective heat dissipation without excessive material complexity.
3Device complexity
If vanadium dioxide is used without any modification, then material simplicity is maintained, but thermal conductivity is insufficient for suppressing excessive temperature rise
Solution Approach 1:
The patent modifies vanadium dioxide by bonding it to a highly thermally conductive substance, creating a composite material that maintains the latent heat storage functionality while significantly improving thermal conductivity. This enables the material to suppress excessive temperature rise effectively without requiring complex structural modifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The material achieves enhanced thermal conductivity, enabling rapid heat absorption and storage with suppressed temperature rises, allowing for wide-range adjustment in heat dissipation and storage.
Implementation Method 1
the thermal conductivity of vanadium dioxide is approximately 6 W/mK... vanadium dioxide is inadequate as a heat dissipation material... a solid heat storage material including an bonding of vanadium dioxide and a highly thermally conductive substance higher in thermal conductivity than the vanadium dioxide
Implementation Method 2
a solid heat storage material employing solid-solid phase transition... The material described in Patent Literature 3 has electronic phase transition as the origin of latent heat and thus keeps its shape before and after phase transition without fusion
Implementation Method 3
utilization of latent heat has been examined... heat storage density (latent heat per unit weight or per unit volume) is important in characteristic
Data Source
AI summary
A solid heat storage material includes a bonding of vanadium dioxide and a highly thermally conductive substance higher in thermal conductivity than the vanadium dioxide, the highly thermally conductive substance being dispersed in the vanadium dioxide, the vanadium dioxide and the highly thermally conductive substance adhering closely and densely together, the highly thermally conductive substance having a volume fraction of 0.03 or more.