Vanadium Precursor Composition for Stable, Low-Impurity Thin Film Deposition

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional vanadium precursor compounds lack thermal stability and high vapor pressure, leading to impurities and non-uniform thin films in semiconductor devices, making it difficult to form high-quality vanadium thin films suitable for next-generation electronics.

Innovation Solution

A vanadium precursor compound with an asymmetric cyclopentadiene ligand substituted with alkyl groups, allowing it to exist in a liquid state at room temperature and maintain high vapor pressure, facilitating deposition processes like MOCVD and ALD, resulting in a thin film with reduced impurities and uniform properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional vanadium precursor compounds are used, then the deposition process can be performed, but the thermal stability is insufficient and high impurity content occurs

Engineering Contradiction:
Improvethermal stabilityVSAvoidimpurity content
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent changes the molecular structure parameters of the vanadium precursor compound by introducing specific ligand configurations and substituents. This structural parameter change results in improved thermal stability while maintaining appropriate vapor pressure for deposition, thereby reducing impurity formation during the deposition process

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite molecular structure combining vanadium center with specifically designed organic ligands containing heterocyclic rings and aromatic groups. This composite structure provides both thermal stability and controlled volatility, solving the contradiction between stability and deposition capability

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If conventional vanadium precursor compounds are used, then deposition can proceed, but the vapor pressure is insufficient leading to poor film quality

Engineering Contradiction:
Improvefilm uniformityVSAvoidvapor pressure
Core Design Contradiction:
Manufacturing precisionVSQuantity of substance

Solution Approach 1:

The patent optimizes the vapor pressure parameter by carefully selecting ligand types and substituents. The balanced molecular weight and intermolecular forces achieved through this design provide sufficient vapor pressure for effective deposition while maintaining film uniformity through stable precursor behavior

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If conventional vanadium precursor compounds are used, then the process can be completed, but carbon impurities are introduced into the thin film

Engineering Contradiction:
Improvedeposition processabilityVSAvoidcarbon impurity content
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The patent introduces specific functional groups and heteroatoms (such as oxygen-containing groups) at specific positions in the ligand structure. These localized structural modifications reduce carbon impurity generation during decomposition while maintaining the overall processability and deposition characteristics of the precursor compound

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The vanadium precursor compound ensures high thermal stability and vapor pressure, enabling the formation of high-quality, uniform thin films with low carbon impurity content, suitable for semiconductor applications.

Implementation Method 1

the vanadium precursor compound according to an embodiment of the present disclosure has an advantage of having a high vapor pressure and excellent thermal stability

Methodology Applied
Scientific EffectVapor pressure: Vapour Pressure

Implementation Method 2

depositing the thin film on a substrate through a metal organic chemical vapor deposition (MOCVD) process or an atomic layer deposition (ALD) process

Methodology Applied
Scientific EffectChemical vapor deposition: Chemical Vapour Deposition

Data Source

PatentUS20260015715A1Vanadium precursor compound for thin film deposition and method of forming thin film containing vanadium using the same
Publication Date: 2026.01.15 EGTM CO LTD
  • US20260015715A1 patent drawing
  • US20260015715A1 patent drawing
  • US20260015715A1 patent drawing

AI summary

An embodiment of the present disclosure provides a vanadium precursor compound represented by Chemical Formula 1 or 2.(In Chemical Formula 1, R1, R2, R3 and R4 are each independently selected from hydrogen, a linear alkyl group having 1 to 6 carbon atoms and a branched alkyl group having 3 to 4 carbon atoms, and in Chemical Formula 2, n is an integer of 0 to 4, a ring including a vanadium element is a heterocycloalkyl group or a heterocycloalkene group, and R1, R2, R3, R4, R5 and R6 are each independently selected from hydrogen, a linear alkyl group having 1 to 6 carbon atoms and a branched alkyl group having 3 to 6 carbon atoms.)