Vanadium Schottky Barrier Layer for Low-Voltage Semiconductor Contacts

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Solution Overview

Problem

Semiconductor devices, such as Schottky barrier diodes, face challenges in achieving low forward voltage and low reverse current, with existing barrier layers not adequately addressing the trade-off between these electrical characteristics.

Innovation Solution

Incorporating a barrier layer with vanadium or a vanadium compound as a major component, in conjunction with a metal layer, on the semiconductor device, which forms a Schottky contact and reduces forward voltage while managing reverse current through a stacked or single-layer structure, and integrating a RESURF structure to enhance reverse breakdown voltage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If a conventional barrier layer is used in a Schottky barrier diode, then the reverse current can be maintained at acceptable levels, but the forward voltage remains too high

Engineering Contradiction:
Improveforward voltageVSAvoidreverse current
Core Design Contradiction:
Loss of energyVSReliability

Solution Approach 1:

The patent changes the material parameter of the barrier layer from conventional materials (titanium, platinum, aluminum) to vanadium-based materials. This material substitution fundamentally alters the Schottky barrier properties, achieving a lower forward voltage (0.65V at 10A) while maintaining acceptable reverse current characteristics. The vanadium material's specific electronic structure and work function provide the optimal balance between forward conduction and reverse blocking.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite electrode structure consisting of a vanadium-based barrier layer combined with a metal layer (such as molybdenum, tungsten, or copper). This composite structure leverages the low barrier height of vanadium for reduced forward voltage and the favorable electrical properties of the metal layer for current conduction and stability, achieving superior overall performance compared to single-material barriers.

Inventive Principle:
Principle #40Composite materials

2Loss of energy

If the barrier layer is optimized for low forward voltage, then energy loss decreases, but reverse current increases

Engineering Contradiction:
Improveforward voltageVSAvoidreverse current
Core Design Contradiction:
Loss of energyVSObject-generated harmful factors

Solution Approach 1:

By selecting vanadium as the barrier layer material, the patent fundamentally changes the barrier's electronic parameters including work function and carrier concentration. This material-specific parameter change creates an asymmetric conduction characteristic where forward voltage is reduced (lower energy loss) while the reverse current remains suppressed due to vanadium's inherent material properties and its interaction with the semiconductor substrate.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent references and compares the performance against conventional barrier materials (titanium, platinum, aluminum) to demonstrate the superiority of the vanadium-based solution. By establishing a benchmark comparison, the invention validates that the vanadium barrier achieves lower forward voltage without the proportional increase in reverse current that plagues conventional low-voltage barrier designs.

Inventive Principle:
Principle #26Copying

3Device complexity

If a simple single-layer electrode structure is used, then device complexity is reduced, but electrical characteristics cannot be optimized

Engineering Contradiction:
Improveelectrode structureVSAvoidcurrent-voltage characteristics
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent implements a two-layer composite electrode structure where a vanadium-based barrier layer is combined with a metal layer. This composite design achieves optimal electrical characteristics by leveraging the low barrier height of vanadium for reduced forward voltage and the excellent electrical conductivity and stability of the metal layer, while maintaining a relatively simple overall structure that can be integrated into standard semiconductor fabrication processes.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The electrode structure is segmented into functionally distinct layers: the vanadium-based barrier layer handles the Schottky barrier formation and voltage control, while the metal layer provides current conduction and mechanical stability. This functional segmentation allows each layer to be optimized for its specific role, achieving superior overall performance without excessive complexity.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The use of vanadium-based barrier layers effectively reduces forward voltage and reverse current, improving the current-voltage characteristics of semiconductor devices, although further reduction in reverse current is desirable for optimal performance.

Implementation Method 1

a barrier layer which contacts the first semiconductor layer and includes vanadium or a vanadium compound as a major component

Methodology Applied
Scientific EffectSchottky barrier:

Implementation Method 2

improving the current-voltage characteristics of semiconductor devices

Methodology Applied
Scientific EffectElectron transport:

Data Source

PatentUS11830920B2Semiconductor device
Publication Date: 2023.11.28 KK TOSHIBA
  • US11830920B2 patent drawing
  • US11830920B2 patent drawing
  • US11830920B2 patent drawing

AI summary

A semiconductor device includes a semiconductor part including a first semiconductor layer of a first conductivity type; a first electrode provided on a back surface of the semiconductor part; and a second electrode provided on a front surface of the semiconductor part. The second electrode includes a barrier layer and a metal layer. The barrier layer contacts the first semiconductor layer and including vanadium or a vanadium compound as a major component. The metal layer is provided on the barrier layer.