Vapor Chamber Bending Section Bridging Element Density

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Solution Overview

Problem

Vapor chambers with high thermal conductivity are not easily suitable for device miniaturization due to their planar configuration or large bending radius, which restricts their ability to be bent at smaller radii without rupturing, limiting their application in compact electronic components where high heat dissipation is required.

Innovation Solution

A vapor chamber design featuring a bending section with a lower volume fraction of bridging elements compared to a non-bending section, allowing for easier bending at small radii and improved heat exchange by reducing the density of bridging elements in the bending section, enabling a compact, meandering shape for enhanced heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If vapor chambers are designed with high thermal conductivity and planar configuration, then thermal performance is improved, but device miniaturization is restricted due to large bending radius requirements

Engineering Contradiction:
Improvethermal performanceVSAvoiddevice size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The vapor chamber is designed with heterogeneous bridging element distribution, where the bending section has a lower volume fraction of bridging elements compared to the non-bending section. This local variation in structure allows the bending section to be more flexible and accommodate small bending radii, while the non-bending section maintains high thermal conductivity through denser bridging elements.

Inventive Principle:
Principle #3Local quality

2Volume of moving object

If vapor chambers are bent at small radii for miniaturization, then device compactness is improved, but the vapor chamber ruptures due to structural integrity failure

Engineering Contradiction:
Improvedevice sizeVSAvoidstructural integrity
Core Design Contradiction:
Volume of moving objectVSStrength

Solution Approach 1:

The bridging elements are strategically distributed with lower density in the bending section and higher density in the non-bending section. This local differentiation allows the bending section to flex without rupturing while maintaining overall structural integrity, enabling small bending radii without compromising strength.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The vapor chamber is functionally segmented into a bending section and a non-bending section with different bridging element volume fractions. This segmentation allows each section to be optimized for its specific function: the bending section for flexibility and the non-bending section for thermal performance and structural strength.

Inventive Principle:
Principle #1Segmentation

3Ease of manufacture

If uniform bridging element distribution is used throughout the vapor chamber, then manufacturing simplicity is maintained, but bending capability at small radii is lost

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidbending capability
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

Instead of uniform bridging element distribution, the invention implements local quality variation where the bending section has a lower volume fraction of bridging elements. This localized modification enables bending capability at small radii while maintaining relatively simple manufacturing processes through controlled spatial variation of the bridging element density.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enables vapor chambers to be bent at small radii without rupturing, facilitating compact configurations and improved heat dissipation through a reduced bridging element density in the bending section, enhancing thermal performance in miniaturized electronic components.

Implementation Method 1

a first thermally conductive plate and a second thermally conductive plate separated from each other by a plurality of bridging elements

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

Vapor chambers are known in the art... a heated section, two heat-transmitting sections bent and extended upward from both sides of the heated section respectively, a condensing section

Methodology Applied
Scientific EffectPhase change: Phase Change

Data Source

PatentUS20240200765A1A vapor chamber
Publication Date: 2024.06.20 SIGNIFY HOLDING BV
  • US20240200765A1 patent drawing
  • US20240200765A1 patent drawing
  • US20240200765A1 patent drawing

AI summary

This invention relates to a vapor chamber (100) comprising a first thermally conductive plate (110) and a second thermally conductive plate (120) separated from each other by a plurality of bridging elements (140) to form a cavity (130) having a first height, H1 (001). The vapor chamber (100) comprises a bending section (151) and a non-bending section (152). The bending section (151) is configured to provide a bend having a first volume fraction (V1) of bridging elements (140), and the non-bending section (152) having a second volume fraction (V2) of bridging elements (140). A ratio of the first volume fraction (V1) and the second volume fraction (V2) is less than 0.7.