Vapor Chamber Capillary Layout for Low-Resistance Coolant Return

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Solution Overview

Problem

The existing vapor chambers face high resistance to coolant return and significant temperature differences, hindering effective heat dissipation cycles.

Innovation Solution

The vapor chamber design incorporates capillary structures with varying capillary forces and thicknesses on different surfaces to facilitate efficient coolant circulation, including capillary rib plates and grooves to enhance liquid distribution and reduce temperature differences.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single capillary structure is used in the vapor chamber, then the structure is simple, but the coolant return resistance is high and temperature equalization is poor

Engineering Contradiction:

Improvecapillary structureVSAvoidheat dissipation cycle

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The capillary structure is divided into multiple independent capillary channels with different capillary forces, allowing each channel to serve different functions in the heat dissipation cycle. This segmentation enables optimized coolant flow paths while maintaining structural integrity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the capillary structure are assigned different capillary forces tailored to local requirements. The first capillary structure has a first capillary force optimized for one region, while the second capillary structure has a second capillary force optimized for another region, enabling localized optimization of coolant flow and heat dissipation.

Inventive Principle:

Principle #3Local quality

2Ease of manufacture

If uniform capillary structure thickness is used, then manufacturing is easier, but temperature difference for heat transfer is large

Engineering Contradiction:

Improvecapillary structureVSAvoidtemperature difference

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The capillary structure employs varying thicknesses in different regions to optimize heat transfer. Thicker portions are placed where larger temperature differences exist, providing enhanced heat dissipation capacity, while thinner portions are used where temperature is more uniform, thereby reducing overall temperature differential across the vapor chamber.

Inventive Principle:

Principle #3Local quality

3Speed

If high capillary force is used throughout, then coolant return is faster, but evaporation performance at high heat flux is reduced

Engineering Contradiction:

Improvecoolant return speedVSAvoidevaporation performance

Core Design Contradiction:

SpeedVSProductivity

Solution Approach 1:

The capillary structure is segmented into regions with different capillary forces. The first capillary structure with its specific capillary force optimizes coolant return in its region, while the second capillary structure with different capillary force optimizes evaporation performance in its region, allowing both functions to coexist without compromise.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different capillary forces are applied locally to match the thermal and flow requirements of different regions. Regions requiring rapid coolant return are equipped with capillary structures optimized for return, while regions requiring high evaporation performance have capillary structures optimized for liquid supply, achieving both goals simultaneously.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces coolant return resistance and temperature differences, ensuring continuous heat dissipation and preventing hot spots, thereby improving heat dissipation efficiency.

Implementation Method 1

a first capillary structure is disposed on the first part, and a second capillary structure is disposed on the second part. A capillary force of the first capillary structure is less than a capillary force of the second capillary structure

Methodology Applied

Scientific EffectCapillary force: Capillary Action

Implementation Method 2

heat that is input to the evaporator evaporates liquid in a wick on the evaporator. Then, the vapor flows throughout the entire chamber

Methodology Applied

Scientific EffectEvaporation: Evaporation

Implementation Method 3

the vapor is condensed at an upper end 02 of the housing 1, and heat is removed through forced convection, natural convection, or liquid cooling

Methodology Applied

Scientific EffectCondensation: Condensation

Implementation Method 4

The vapor chamber transfers heat of the chip to a heat sink or air, to implement heat dissipation of the chip

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250212366A1Vapor chamber, electronic device, and chip package structure

Publication Date: 2025.06.26 HUAWEI TECH CO LTD

AI summary

A vapor chamber, an electronic device, and a chip package structure are provided. The vapor chamber includes a housing. A cavity is formed in the housing, and the cavity contains a coolant. The housing has a first surface and a second surface that enclose the cavity. A first capillary structure is disposed on both the first surface and the second surface. The coolant may return from the second surface to a first part of the first surface through the first capillary structure. A second capillary structure is disposed on a second part of the first surface. The coolant returning to the first part returns to the second part through the second capillary structure. A capillary force of the first capillary structure is less than a capillary force of the second capillary structure.