Vapor Chamber Wick Structure for Faster Condensate Return
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Solution Overview
Problem
Existing vapor chambers are inefficient in distributing heat generated by electronic components, leading to potential overheating due to inadequate cooling.
Innovation Solution
The vapor chamber design includes condensate transport structures and enhanced wick structures to accelerate the transport of working fluid back to the heat source, increasing the surface area for heat dissipation and improving thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If heat is conducted through a limited area of the electronic component to a larger area of the vapor chamber, then the heat distribution area is increased, but the heat distribution efficiency is insufficient leading to inadequate cooling
Solution Approach 1:
The vapor chamber is segmented into multiple functional zones: an evaporator region with wick structure directly contacting the heat source, a vapor transport region, and a condenser region with condensate transport structures. This segmentation allows different regions to perform specialized functions, improving overall heat distribution efficiency while maintaining large area coverage.
Solution Approach 2:
The patent introduces vertical dimensionality through multi-layer wick structures and three-dimensional condensate transport channels. The condensate transport structures extend vertically from the condenser surface, creating additional surface area for phase change and fluid transport, thereby enhancing cooling efficiency without increasing the horizontal footprint.
2Reliability
If condensate transport structures are added to accelerate working fluid transport, then the cooling efficiency is improved, but the device complexity increases
Solution Approach 1:
The condensate transport structures are merged with the condenser wick structure, forming an integrated condensation and transport system. The wick material itself serves dual functions: facilitating heat transfer during condensation and providing capillary channels for condensate removal, thereby improving cooling efficiency without adding separate complex transport mechanisms.
Solution Approach 2:
The condensate transport relies on self-generated capillary pressures within the wick structure and density-driven natural convection currents. The phase change process itself generates the driving force for fluid circulation, eliminating the need for external pumps or complex control systems, thus maintaining structural simplicity while achieving efficient cooling.
3Volume of moving object
If the vapor chamber is designed for thin and compact electronic devices, then the device size is reduced, but the heat dissipation capability is insufficient
Solution Approach 1:
The vapor chamber employs thin-walled plate structures with integrated wick layers that provide high surface area to volume ratio. The wick structures are formed as thin films or coatings on the internal surfaces, enabling efficient heat transfer without requiring thick walls, thus maintaining compact size while enhancing heat dissipation capability.
Solution Approach 2:
The patent utilizes rapid phase transitions between liquid and vapor phases of the working fluid to achieve high heat transfer coefficients in a compact volume. The quick evaporation and condensation cycles allow large amounts of heat to be transferred through thin chamber walls, providing effective cooling for compact electronic devices without requiring large thermal mass.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced design efficiently distributes heat generated by electronic components, preventing overheating by effectively cooling them through increased surface area and capillary pumping actions.
Implementation Method 1
The generated heat of the electronic component is conducted through a limited area of the electronic component to a larger area of the vapor chamber
Implementation Method 2
The generated heat of the electronic component is conducted through a limited area of the electronic component to a larger area of the vapor chamber
Implementation Method 3
speeding up transport of working fluid back to a heat source
Implementation Method 4
The second plate includes a plurality of condensate transport structures. The condenser wick structure is disposed on the plurality of condensate transport structures
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
A vapor chamber may include a first plate, evaporator wick structure, second plate, and condenser wick structure. The first plate includes a first surface, first plate perimeter ledge, plurality of first support structures, and plurality of second support structures. The plurality of first support structures and plurality of second support structures are coupled to and extend from the first surface. The first plate perimeter ledge surrounds the first surface. The evaporator wick structure includes a first surface wick portion and first support wick portion. The first surface wick portion is disposed on the first surface and the first support wick portion is disposed on the plurality of first support structures. The second plate includes a second surface and second plate perimeter portion. The second plate perimeter portion surrounds the second surface and is coupled to the first plate perimeter ledge. The condenser wick structure is disposed on the second surface.