3D Condensing Vapor Chamber for Compact Electronics Cooling
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Solution Overview
Problem
Existing vapor chambers are inefficient in dissipating heat generated by electronic components, leading to overheating due to inadequate thermal management in thin and compact electronic devices.
Innovation Solution
A vapor chamber design featuring a first plate with condensing structures and a second plate that forms a chamber, incorporating wick structures and heat pipes to enhance thermal exchange and fluid condensation, with recessed structures and support structures to optimize heat transfer and fluid flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional vapor chamber is used to cool electronic components, then the device structure remains compact, but the thermal dissipation efficiency is insufficient leading to overheating
Solution Approach 1:
The patent introduces a three-dimensional condensing structure with protrusions and recesses on the condensing surface, transforming the traditional two-dimensional flat surface into a multi-dimensional topology. This dimensional change increases the thermal exchange area without significantly increasing the overall device volume, thereby improving thermal dissipation efficiency while maintaining compact form factor.
Solution Approach 2:
The condensing surface is segmented into multiple protruding and recessed regions, creating a distributed condensation area. This segmentation allows vapor to condense at multiple locations simultaneously, enhancing the overall condensation efficiency and heat dissipation performance without requiring a single large flat surface.
2Temperature
If the condensing surface area is increased to improve heat dissipation, then thermal exchange efficiency improves, but the device volume increases
Solution Approach 1:
By creating protrusions and recesses on the condensing surface, the patent effectively increases the surface area available for thermal exchange without proportionally increasing the device volume. The three-dimensional structure utilizes vertical space within the existing vapor chamber envelope, allowing enhanced heat dissipation while maintaining a compact overall footprint.
Solution Approach 2:
The condensing structures with protrusions and recesses are nested within the existing vapor chamber structure. The recessed portions create internal cavities that are integrated into the overall chamber design, allowing the condensation surface to be embedded within the available volume rather than requiring additional external space.
3Temperature
If wick structures and heat pipes are added to enhance fluid return efficiency, then thermal management improves, but manufacturing complexity increases
Solution Approach 1:
The patent integrates the wick structures and heat pipes as unified components within the vapor chamber assembly. The wick structures are positioned to work in conjunction with the condensing structures, and heat pipes are embedded to facilitate fluid circulation. This merging of functions into a integrated thermal management system improves fluid return efficiency while consolidating manufacturing steps compared to separate assemblies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal dissipation efficiency by increasing the thermal exchange area and fluid return efficiency, effectively managing heat in electronic devices.
Implementation Method 1
a condensing assembly being disposed on the condensing surface so that outer surfaces of the condensing assembly and the condensing surface are integrated to form a thermal exchange surface configured to condense a vaporized cooling fluid into liquid
Implementation Method 2
The generated heat of the electronic component is conducted from a small and limited area of the electronic component to a greater area of the vapor chamber
Implementation Method 3
incorporating wick structures and heat pipes to enhance thermal exchange and fluid condensation
Data Source
AI summary
A vapor chamber includes a first plate having a condensing surface, a second plate configured to assemble with the first plate to form a chamber, the condensing surface is facing the second plate, the second plate having a heat absorbing surface facing away from the condensing surface, and the heat absorbing surface is configured to thermally coupled to a heat source, and a condensing assembly being disposed on the condensing surface so that outer surfaces of the condensing assembly and the condensing surface are integrated to form a thermal exchange surface, the thermal exchange surface is configured to condense a vaporized cooling fluid into liquid.