Vapor Chamber Cooling Module for Stepped CPU GPU Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electronic apparatuses with CPUs and GPUs having a step between their surfaces require an efficient cooling module that can accommodate this step and maintain high thermal efficiency, especially during turbo operations.
Innovation Solution
The cooling module incorporates a first heat pipe connected to the CPU, a plate-shaped vapor chamber connected to the GPU, and a second heat pipe overlapping both components, along with fins to enhance heat dissipation and absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a cooling module is designed to accommodate the step between CPU and GPU surfaces, then the cooling module can fit the physical layout, but the thermal efficiency may be reduced due to the complex structure
Solution Approach 1:
The patent utilizes the step difference between CPU and GPU surfaces in the vertical dimension to place the vapor chamber strategically. The vapor chamber is positioned at a height that allows it to contact both the CPU and GPU heat generating elements, effectively using the vertical space created by the step to achieve comprehensive heat absorption without adding horizontal complexity.
Solution Approach 2:
The vapor chamber serves as an intermediary component between the CPU and GPU heat generating elements and the heat pipes. It absorbs heat from both components and transfers it to the heat pipes, mediating the thermal transfer process and maintaining efficiency despite the step difference between components.
2Ease of manufacture
If a cooling module uses a simple structure, then the manufacturing is easier, but it cannot efficiently cool both heat generating elements with a step between them
Solution Approach 1:
The cooling module is segmented into distinct functional components: vapor chambers for heat absorption, heat pipes for heat transfer, and fins for heat dissipation. Each component is optimized for its specific function, allowing for modular assembly and manufacturing while maintaining overall cooling efficiency.
Solution Approach 2:
The solution moves from a two-dimensional planar cooling approach to a three-dimensional vertical stacking approach. The vapor chamber is positioned at a specific vertical height to contact both CPU and GPU surfaces, utilizing the vertical dimension to achieve efficient cooling of both components with a relatively simple overall structure.
3Power
If the cooling module uses a vapor chamber to absorb heat from both CPU and GPU, then the heat absorption capacity increases, but the device complexity increases due to additional components
Solution Approach 1:
The vapor chamber merges the heat absorption function for both CPU and GPU into a single component. Instead of using separate cooling solutions for each heat generating element, the vapor chamber is designed to contact and absorb heat from both components simultaneously, reducing the number of parts while increasing heat absorption capacity.
Solution Approach 2:
The vapor chamber serves multiple functions: it absorbs heat from both the CPU and GPU heat generating elements, acts as a heat distribution manifold, and transfers heat to the heat pipes. This multi-functionality reduces the need for additional components and simplifies the overall cooling module structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration efficiently cools both heat generating elements, extends the turbo operation time of the CPU, and ensures effective heat management even under varying load conditions.
Implementation Method 1
a first heat pipe having a first surface 38c thereof connected to a surface 30b of the CPU 30
Implementation Method 2
the heat pipe stacked on a surface of the first heat generating element
Implementation Method 3
a plate-shaped vapor chamber having a first surface 36a thereof connected to a surface 31b of the GPU 31 and a second surface 38d of the first heat pipe 38
Implementation Method 4
a first fin 40 connected to the first heat pipe 38; and a second fin 41 connected to the second heat pipe 39
Implementation Method 5
the second heat pipe which is connected to a second surface 36b of the vapor chamber 36 and overlaps the second heat generating element
Data Source
AI summary
An electronic apparatus includes: a chassis; a first and a second heat generating elements which are placed with a step between surfaces thereof; and a cooling module that absorbs heat generated by the first and the second heat generating elements. The cooling module has: a first heat pipe having a first surface thereof connected to a surface of the first heat generating element; a plate-shaped vapor chamber having a first surface thereof connected to a surface of the second heat generating element and a second surface of the first heat pipe; a second heat pipe which is connected to a second surface of the vapor chamber and overlaps the second heat generating element; a first fin connected to the first heat pipe; and a second fin connected to the second heat pipe.